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| EM78P458/459 OTP ROM EM78P458/459 8-BIT MICRO-CONTROLLER Version 1.4 EM78P458/459 OTP ROM Specification Revision History Version 1.0 1.1 1.2 1.3 1.4 Initial version Modify ERC frequency Add AD & OP spec Change Power on reset content Add the Device Characteristic at section 6.5 03/06/2003 05/07/2003 07/01/2003 06/25/2004 Content Application Note AN-001 A/D Pre-amplifier AN-002 Calibration Offset on A/D AN-003 Example of Microcomputer Digital Thermometer AN-004 Tips on how to apply EM78P458 AN-005 Tips on how to apply A/D Converter AN-006 AD & R4 AN-007 Enhancing Noise Immunity This specification is subject to change without prior notice. 2 06.25.2004 (V1.4) EM78P458/459 OTP ROM 1. GENERAL DESCRIPTION EM78P458 and EM78P459 are 8-bit microprocessors designed and developed with low-power and high-speed CMOS technology. It is equipped with a 4K*13-bit Electrical One Time Programmable Read Only Memory (OTP-ROM). With its OTP-ROM feature, it is able to offer a convenient way of developing and verifying user's programs. Moreover, user can take advantage of EMC Writer to easily program his development code. This specification is subject to change without prior notice. 3 06.25.2004 (V1.4) EM78P458/459 OTP ROM 2. FEATURES * Operating voltage range: 2.3V~5.5V * Operating temperature range: 0C~70C * Operating frequency range(base on 2 clocks): * Crystal mode: DC ~ 20MHz/2clks,5V; DC ~ 8MHz/2clks,3V * RC mode: DC ~ 4MHz/2clks,5V; DC ~ 4MHz/2clks,3V * Low power consumption: * Less than 1.5 mA at 5V/4MHz * Typically 15 A, at 3V/32KHz * Typically 1 A, during sleep mode * 4K x 13 bits on chip ROM * 84 x 8 bits on chip registers (SRAM) * 2 bi-directional I/O ports * 8 level stacks for subroutine nesting * 8-bit real time clock/counter (TCC) with selective signal sources, trigger edges, and overflow interrupt * 8-bit multichannel Analog-to-Digital Converter with 8-bit resolution * Dual Pulse Width Modulation (PWM ) with 10-bit resolution * One pair of comparators * Power-down (SLEEP) mode * Six available interruptions * TCC overflow interrupt * Input-port status changed interrupt (wake up from the sleep mode) * External interrupt * ADC completion interrupt * PWM period match completion * Comparator high interrupt * Programmable free running watchdog timer * 8 Programmable pull-down I/O pins * 7 programmable pull-high I/O pins * 8 programmable open-drain I/O pins * Two clocks per instruction cycle * Package types: This specification is subject to change without prior notice. 4 06.25.2004 (V1.4) EM78P458/459 OTP ROM * 20 pin DIP 300mil * 20 pin SOP 300mil : EM78P458AP : EM78P458AM * 24 pin skinny DIP 300mil : EM78P459AK * 24 pin SOP 300mil : EM78P459AM This specification is subject to change without prior notice. 5 06.25.2004 (V1.4) EM78P458/459 OTP ROM 3. PIN ASSIGNMENT P56/CIN+ P57/CO P56/CIN+ P57/CO P60/ADC1 P61/ADC2 Vss P62/ADC3 P63/ADC4 P64/ADC5 P65/ADC6 P66/ADC7 1 2 3 4 EM78P458 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 P55/CINP54/TCC OSCI OSCO VDD P53/VREF P52/PWM2 P51/PWM1 P50/INT P67/ADC8 1 2 3 4 5 6 7 8 9 10 11 12 EM78P459 24 23 22 21 20 19 18 17 16 15 14 13 P55/CINP54/TCC OSCI OSCO RESET VDD VDD P53/VREF P52/PWM2 P51/PWM1 P50/INT P67/ADC8 P60/ADC1 P61/ADC2 ENTCC Vss Vss P62/ADC3 P63/ADC4 P64/ADC5 P65/ADC6 P66/ADC7 Fig. 1 Pin Assignment Table 1 EM78P458 Pin Description Symbol VDD OSCI Pin No. 16 18 Type Function Power supply. * XTAL type: Crystal input terminal or external clock input pin. I * RC type: RC oscillator input pin. *XTAL type: Output terminal for crystal oscillator or external clock input pin. O *RC type: Clock output with a period of one instruction cycle time, the prescaler is determined by the CONT register. * External clock signal input. * General-purpose Input only. I * Default value while power-on reset. I/O I/O I I O I * General-purpose I/O pin. * Default value while power-on reset. * General-purpose I/O pin. * Default value while power-on reset. * External interrupt pin triggered by falling edge. * Analog to Digital Converter. * Defined by AD-CMPCON (IOCA0)<2:4>. * Pulse width modulation outputs. * Defined by PWMCON (IOC51)<6, 7> * External reference voltage for ADC * Defined by AD-CMPCON (IOCA0)<7>. 6 06.25.2004 (V1.4) OSCO 17 P50 P51 ~ P57 P60 ~ P67 INT ADC1~ADC8 PWM1, PWM2 VREF 12 13~15 19, 20, 1, 2 3, 4, 6~11 12 3, 4, 6 ~ 11 13, 14 15 This specification is subject to change without prior notice. EM78P458/459 OTP ROM * "-" -> the input pin of Vin- of the comparator. * "+"-> the input pin of Vin+ of the comparator. * Pin CO is the output of the comparator. * Defined by AD-CMPCON (IOCA0) <5, 6> * Real time clock/counter with Schmitt trigger input pin; it must be tied to VDD or VSS if it is not in use. Ground. CIN-, CIN+, CO TCC VSS 20, 1,2 19 5 I O I - Table 2 EM78P459 Pin Description Symbol VDD OSCI Pin No. 19, 18 22 Type Function Power supply. * XTAL type: Crystal input terminal or external clock input pin. I * RC type: RC oscillator input pin. * XTAL type: Output terminal for crystal oscillator or external clock input pin. O * RC type: Clock output with a period of one instruction cycle time, the prescaler is determined by the CONT register. * External clock signal input. * General-purpose Input only. I * Default value while power-on reset. I/O I/O I I O I I * General-purpose I/O pin. * Default value while power-on reset. * General-purpose I/O pin. * Default value while power-on reset. * External interrupt pin triggered by falling edge. * Analog to Digital Converter. * Defined by AD-CMPCON (IOCA0)<2:4>. * Pulse width modulation outputs. * Defined by PWMCON (IOC51)<6, 7> * External reference voltage for ADC * Defined by AD-CMPCON (IOCA0)<7>. * `-' -> the Vin- input pins of the comparators. * `+' -> the Vin+ input pins of the comparators. * Pin CO is the output of the comparator. * Defined by AD-CMPCON (IOCA0) <5, 6> * If it remains at logic low, the device will be reset. * Wake up from sleep mode when pins status changes. * Voltage on /RESET/Vpp must not be over Vdd during normal mode. * Pull-high is on if /RESET is asserted. * Real time clock/counter with Schmitt trigger input pin; it must be tied to VDD or VSS if it is not in use. 1: Enable TCC; 0: Disable TCC. Ground. OSCO 21 P50 P51 ~ P57 P60 ~ P67 INT ADC1~ADC8 PWM1, PWM2 VREF CIN-, CIN+, CO 14 15~17 23, 24 1, 2 3, 4, 8~13 14 3, 4, 8~13 15, 16 17 24, 1, 2 /RESET TCC ENTCC VSS 20 23 5 6, 7 I I I - This specification is subject to change without prior notice. 7 06.25.2004 (V1.4) EM78P458/459 OTP ROM 4. FUNCTION DESCRIPTION WDT Timer WDT Time-out PC STACK 0 STACK 1 STACK 2 Prescaler Oscillator/ Timming Control /INT Interrupt Control ROM Instruction Register STACK 3 STACK 4 STACK 5 ENTCC STACK 6 STACK 7 R1(TCC) Sleep & Wake Up Control RAM R4 Instruction Decoder ALU R3 ACC DATA & CONTROL BUS Comparators IOC5 R5 2 PWMs 8 ADC IOC6 R6 P P P P PP P P 5555 55 55 0123 45 67 P PPPPPP P 66666666 01234567 Fig. 2 The Functional Block Diagram of EM78P458/459 4.1 Operational Registers 1. R0 (Indirect Addressing Register) R0 is not a physically implemented register. Its major function is to perform as an indirect addressing pointer. Any instruction using R0 as a pointer, actually accesses data pointed by the RAM Select Register (R4). 2. R1 (Time Clock /Counter) * Increased by an external signal edge through the TCC pin, or by the instruction cycle clock. * The signals to increase the counter are decided by Bit 4 and Bit 5 of the CONT register. * Writable and readable as any other registers. 3. R2 (Program Counter) & Stack * R2 and hardware stacks are 12-bit wide. The structure is depicted in Fig. 4. * Generates 4Kx13 bits on-chip ROM addresses to the relative programming instruction codes. One program page is 1024 words long. * The contents of R2 are set to all "0"s upon a RESET condition. This specification is subject to change without prior notice. 8 06.25.2004 (V1.4) EM78P458/459 OTP ROM * "JMP" instruction allows the direct loading of the lower 10 program counter bits. Thus, "JMP" allows PC to jump to any location within a page. * "CALL" instruction loads the lower 10 bits of the PC, and then PC+1 is pushed into the stack. Thus, the subroutine entry address can be located anywhere within a page. * "RET" ("RETL k", "RETI") instruction loads the program counter with the contents of the top of stack. * "ADD R2, A" allows a relative address to be added to the current PC, and the ninth and tenth bits of the PC are cleared. * "MOV R2, A" allows to load an address from the "A" register to the lower 8 bits of the PC, and the ninth and tenth bits of the PC are cleared. * Any instruction that is written to R2 (e.g. "ADD R2, A", "MOV R2, A", "BC R2, 6",) will cause the ninth bit and the tenth bit (A8~A9) of the PC to be cleared. Thus, the computed jump is limited to the first 256 locations of a page. * In the case of EM78P458/459, the most two significant bits (A11 and A10) will be loaded with the content of PS1 and PS0 in the status register (R3) upon the execution of a "JMP", "CALL", or any other instructions set which write to R2. * All instructions are single instruction cycle (fclk/2 or fclk/4) except for the instructions which write to R2, need one more instruction cycle. 000H 008H Reset Vector Interrupt Vector 000 PC A11, A10 00 A9 ~ A0 Pa 0 ge 3 FF 400 Pa 1 ge 7 FF 800 01 Pa 2 ge BFF C00 10 11 Pa 3 ge FFFH FFF Stack Level 0 Stack Level 1 Stack Level 2 Stack Level 3 Stack Level 4 Stack Level 5 Stack Level 6 Stack Level 7 This specification is subject to change without prior notice. User Memory Space On-chip Program Memory Fig. 3 Program Counter Organization 9 06.25.2004 (V1.4) EM78P458/459 OTP ROM Address PAGE registers IOC PAGE registers IOC PAGE registers 00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F 10 J 1F 20 J 3F R0 (IAR) R1 (TCC) R2 (PC) R3 (Status) R4 RSR) R5 (Port5) R6 (Port6) R7 R8 R9 RA General Registers General Registers (ADCON) (ADDATA) Reserve Reserve Reserve Reserve Reserve IOC50 (I/O Port Control Register) IOC60 (I/O Port Control Register) Reserve Reserve IOC90 (GCON) IOCA0 (AD-CMPCON) Reserve Reserve Reserve Reserve Reserve IOC51 (PWMCON) IOC61 (DT1L) IOC71 (DT1H) IOC81 (PRD1) IOC91 (DT2L) IOCA1 (DT2H) RB General Registers RC General Registers (Only two bits) RD General Registers RE General Registers (Only two bits) RF (Interrupt status) General Registers IOCB0 (Pull-down Control Register) IOCB1 (PRD2) IOCC0 (Open-drain Control Register) IOCC1 (DL1L) IOCD0 (Pull-high Control Register) IOCE0 (WDT Control Register) IOCF0 (Interrupt Mask Register) IOCD1 (DL1H) IOCE1 (DL2L) IOCF1 (DL2H) Bank 0 Bank 1 Fig. 4 Data Memory Configuration This specification is subject to change without prior notice. 10 06.25.2004 (V1.4) EM78P458/459 OTP ROM 4. R3 (Status Register) 7 CMPOUT 6 PS1 5 PS0 4 T 3 P 2 Z 1 DC 0 C * Bit 7 (CMPOUT) the result of the comparator output. * Bit 6 (PS1) ~ 5 (PS0) Page select bits. PS0~PS1 are used to select a program memory page. When executing a "JMP", "CALL", or other instructions which cause the program counter to be changed (e.g. MOV R2, A), PS0~PS1 are loaded into the 11th and 12th bits of the program counter where it selects one of the available program memory pages. Note that RET (RETL, RETI) instruction does not change the PS0~PS1 bits. That is, the return will always be to the page from the place where the subroutine was called, regardless of the current setting of PS0~PS1 bits. PS1 0 0 1 1 PS0 0 1 0 1 Program memory page [Address] Page 0 [000-3FF] Page 1 [400-7FF] Page 2 [800-BFF] Page 3 [C00-FFF] * Bit 4 (T) Time-out bit. Set to 1 by the "SLEP" and "WDTC" commands, or during Power on and reset to 0 by WDT time-out. * Bit 3 (P) Power-down bit. Set to 1 during power-on or by a "WDTC" command and reset to 0 by a "SLEP" command. * Bit 2 (Z) Zero flag. Set to "1" if the result of an arithmetic or logic operation is zero. * Bit 1 (DC) Auxiliary carry flag * Bit 0 (C) Carry flag 5. R4 (RAM Select Register) * Bit 7 is a general-purpose read/write bit. * Bit 6 is used to select bank 0 or bank 1. * Bits 0~5 are used to select registers (address: 00~3F) in the indirect address mode. 6. R5 ~ R6 (Port 5 ~ Port 6) * R5 and R6 are I/O registers. 7. R7 ~ R8 * All of these are 8-bit general-purpose registers. 8. R9 (ADCON: Analog to Digital Control) 7 6 5 IOCS 4 ADRUN 3 ADPD 2 ADIS2 1 ADIS1 0 ADIS0 * Bit 7:Bit 6 Unemployed, read as `0'; * Bit 5(IOCS): Select the Segment of IO control register. This specification is subject to change without prior notice. 11 06.25.2004 (V1.4) EM78P458/459 OTP ROM 1 = Segment 1 ( IOC51~IOCF1 ) selected; 0 = Segment 0 ( IOC50~IOCF0 ) selected; * Bit 4 (ADRUN): ADC starts to RUN. 1 = an A/D conversion is started. This bit can be set by software; 0 = reset on completion of the conversion. This bit can not be reset though software; * Bit 3 (ADPD): ADC Power-down mode. 1 = ADC is operating; 0 = switch off the resistor reference to save power even while the CPU is operating. * Bit2:Bit0 (ADIS2:ADIS0): Analog Input Select. 000 = AN0; 001 = AN1; 010 = AN2; 011 = AN3; 100 = AN4; 101 = AN5; 110 = AN6; 111 = AN7; They can only be changed when the ADIF bit and the ADRUN bit are both LOW. 9. RA (ADDATA: the converted value of ADC) When the A/D conversion is complete, the result is loaded into the ADDATA. The START//END bit is cleared, and the ADIF is set. 10. RB An 8-bit general-purpose register. 11. RC A 2-bit, Bit 0and Bit 1 register. 12. RD An 8-bit general-purpose register. 13. RE A 2-bit, Bit 0 and Bit 1 register. 14. RF (Interrupt Status Register) This specification is subject to change without prior notice. 12 06.25.2004 (V1.4) EM78P458/459 OTP ROM 7 6 CMPIF 5 PWM2IF 4 PWM1IF 3 ADIF 2 EXIF 1 ICIF 0 TCIF "1" means interrupt request, and "0" means no interrupt occurs. * Bit 7 Unemployed, read as `0'; * Bit 6 (CMPIF) High-compared interrupt flag. Set when a change occurs in the output of Comparator, reset by software. * Bit 5 (PWM2IF) PWM2 (Pulse Width Modulation) interrupt flag. Set when a selected period is reached, reset by software. * Bit 4 (PWM1IF) PWM1 (Pulse Width Modulation) interrupt flag. Set when a selected period is reached, reset by software. * Bit 3 (ADIF) Interrupt flag for analog to digital conversion. Set when AD conversion is completed, reset by software. * Bit 2 (EXIF) External interrupt flag. Set by falling edge on /INT pin, reset by software. * Bit 1 (ICIF) Port 6 input status change interrupt flag. Set when Port 6 input changes, reset by software. * Bit 0 (TCIF) TCC overflow interrupt flag. Set when TCC overflows, reset by software. * RF can be cleared by instruction but cannot be set. * IOCF0 is the interrupt mask register. * Note that to read RF will result to "logic AND" of RF and IOCF0. 15. R10 ~ R3F * All of these are 8-bit general-purpose registers. 4.2 Special Purpose Registers 1. A (Accumulator) * Internal data transfer, or instruction operand holding * It can not be addressed. 2. CONT (Control Register) 7 INTE 6 INT 5 TS 4 TE 3 PAB 2 PSR2 1 PSR1 0 PSR0 * Bit 7 (INTE) INT signal edge 0: interrupt occurs at the rising edge on the INT pin 1: interrupt occurs at the falling edge on the INT pin * Bit 6 (INT) Interrupt enable flag 0: masked by DISI or hardware interrupt 1: enabled by the ENI/RETI instructions This specification is subject to change without prior notice. 13 06.25.2004 (V1.4) EM78P458/459 OTP ROM * Bit 5 (TS) TCC signal source 0: internal instruction cycle clock. If P54 is used as I/O pin, TS must be 0. 1: transition on the TCC pin * Bit 4 (TE) TCC signal edge 0: increment if the transition from low to high takes place on the TCC pin; 1: increment if the transition from high to low takes place on the TCC pin. * Bit 3 (PAB) Prescaler assignment bit. 0: TCC; 1: WDT. * Bit 2 (PSR2) ~ Bit 0 (PSR0) TCC/WDT prescaler bits. PSR2 0 0 0 0 1 1 1 1 PSR1 0 0 1 1 0 0 1 1 PSR0 0 1 0 1 0 1 0 1 TCC Rate 1:2 1:4 1:8 1:16 1:32 1:64 1:128 1:256 WDT Rate 1:1 1:2 1:4 1:8 1:16 1:32 1:64 1:128 * CONT register is both readable and writable. 3. IOC50 ~ IOC60 (I/O Port Control Register) * "1" puts the relative I/O pin into high impedance, while "0" defines the relative I/O pin as output. * IOC50 and IOC60 registers are both readable and writable. 4. IOC90 (GCON: I/O Configuration & Control of ADC ) 7 OP2E 6 OP1E 5 G22 4 G21 3 G20 2 G12 1 G11 0 G10 * Bit 7 ( OP2E ) Enable the gain amplifier which input is connected to P64 and output is connected to the 8-1 analog switch. 0 = OP2 is off ( default value ), and bypasses the input signal to the ADC; 1 = OP2 is on. * Bit 6 ( OP1E ) Enable the gain amplifier whose input is connected to P60 and output is connected to the 8-1 analog switch. 0 = OP1 is off (default value), and bypasses the input signal to the ADC; 1 = OP1 is on. * Bit 5:Bit 3 (G22 and G20): Select the gain of OP2. 000 = IS x 1 (default value); This specification is subject to change without prior notice. 14 06.25.2004 (V1.4) EM78P458/459 OTP ROM 001 = IS x 2; 010 = IS x 4; 011 = IS x 8; 100 = IS x 16; 101 = IS x 32; Legend: IS = the input signal * Bit 2:Bit 0 (G12 and G10 ): Select the gain of OP1. 000 = IS x 1 (default value); 001 = IS x 2; 010 = IS x 4; 011 = IS x 8; 100 = IS x 16; 101 = IS x 32; Legend: S = the input signal 5. IOCA0 ( AD-CMPCON ): 7 VREFS 6 CE 5 COE 4 IMS2 3 IMS1 2 IMS0 1 CKR1 0 CKR0 * Bit 7: The input source of the Vref of the ADC. 0 = The Vref of the ADC is connected to Vdd (default value), and the P53/VREF pin carries out the function of P53; 1 = The Vref of the ADC is connected to P53/VREF. * Bit 6 (CE): Comparator enable bit 0 = Comparator is off (default value); 1 = Comparator is on. * Bit 5 ( COE ): Set P57 as the output of the comparator 0 = the comparator acts as an OP if CE=1. 1 = act as a comparator if CE=1. * Bit4:Bit2 (IMS2:IMS0): Input Mode Select. ADC configuration definition bit. The following Table describes how to define the characteristic of each pin of R6. Table 3 Description of AD Configuration Control Bits IMS2:IMS0 000 001 010 P60 A A A P61 D A A P62 D D A P63 D D D 15 P64 D D D P65 D D D P66 D D D P67 D D D 06.25.2004 (V1.4) This specification is subject to change without prior notice. EM78P458/459 OTP ROM 011 100 101 110 111 A A A A A A A A A A A A A A A A A A A A D A A A A D D A A A D D D A A D D D D A * Bit 1: Bit 0 (CKR1: CKR0): The prescaler of oscillator clock rate of ADC 00 = 1: 4 (default value); 01 = 1: 16; 10 = 1: 64; 11 = The oscillator clock source of ADC is from WDT ring oscillator frequency. ( frequency=256/18msU 14.2Khz) 6. IOCB0 (Pull-down Control Register) 7 /PD7 6 /PD6 5 /PD5 4 /PD4 3 /PD3 2 /PD2 1 /PD1 0 /PD0 * Bit 7 (/PD7) Control bit is used to enable the pull-down of the P67 pin. 0: Enable internal pull-down; 1: Disable internal pull-down. * Bit 6 (/PD6) Control bit is used to enable the pull-down of the P66 pin. * Bit 5 (/PD5) Control bit is used to enable the pull-down of the P65 pin. * Bit 4 (/PD4) Control bit is used to enable the pull-down of the P64 pin. * Bit 3 (/PD3) Control bit is used to enable the pull-down of the P63 pin. * Bit 2 (/PD2) Control bit is used to enable the pull-down of the P62 pin. * Bit 1 (/PD1) Control bit is used to enable the pull-down of the P61 pin. * Bit 0 (/PD0) Control bit is used to enable the pull-down of the P60 pin. * IOCB0 register is both readable and writable. 7. IOCC0 (Open-Drain Control Register) 7 /OD7 6 /OD6 5 /OD5 4 /OD4 3 /OD3 2 /OD2 1 /OD1 0 /OD0 * Bit 7 (OD7) Control bit used to enable the open-drain of the P57 pin. 0: Enable open-drain output 1: Disable open-drain output * Bit 6 (OD6) Control bit is used to enable the open-drain of the P54 pin. * Bit 5 (OD5) Control bit is used to enable the open-drain of the P52 pin. * Bit 4 (OD4) Control bit is used to enable the open-drain of the P51 pin. * Bit 3 (OD3) Control bit is used to enable the open-drain of the P67 pin. * Bit 2 (OD2) Control bit is used to enable the open-drain of the P66 pin. This specification is subject to change without prior notice. 16 06.25.2004 (V1.4) EM78P458/459 OTP ROM * Bit 1 (OD1) Control bit is used to enable the open-drain of the P65 pin. * Bit 0 (OD0) Control bit is used to enable the open-drain of the P64 pin. * IOCC0 register is both readable and writable. 8. IOCD0 (Pull-high Control Register) 7 /PH7 6 /PH6 5 /PH5 4 3 /PH3 2 /PH2 1 /PH1 0 /PH0 * Bit 7 (/PH7) Control bit is used to enable the pull-high of the P56 pin. 0: Enable internal pull-high; 1: Disable internal pull-high. * Bit 6 (/PH6) Control bit is used to enable the pull-high of the P55 pin. * Bit 5 (/PH5) Control bit is used to enable the pull-high of the P53 pin. * Bit 4 Not used. * Bit 3 (/PH3) Control bit is used to enable the pull-high of the P63 pin. * Bit 2 (/PH2) Control bit is used to enable the pull-high of the P62 pin. * Bit 1 (/PH1) Control bit is used to enable the pull-high of the P61 pin. * Bit 0 (/PH0) Control bit is used to enable the pull-high of the P60 pin. * IOCD0 register is both readable and writable. 9. IOCE0 (WDT Control Register) 7 WDTE 6 EIS 5 4 3 2 1 0 - * Bit 7 (WDTE) Control bit is used to enable Watchdog Timer. 0: Disable WDT; 1: Enable WDT. WDTE is both readable and writable * Bit 6 (EIS) Control bit is used to define the function of the P50 (/INT) pin. 0: P50, input pin only; 1: /INT, external interrupt pin. In this case, the I/O control bit of P50 (bit 0 of IOC50) must be set to "1". When EIS is "0", the path of /INT is masked. When EIS is "1", the status of /INT pin can also be read by way of reading Port 5 (R5). Refer to Fig. 7. EIS is both readable and writable. * Bits 5~0 Not used. This specification is subject to change without prior notice. 17 06.25.2004 (V1.4) EM78P458/459 OTP ROM 10. IOCF0 (Interrupt Mask Register) 7 6 CMPIE 5 PWM2IE 4 PWM1IE 3 ADIE 2 EXIE 1 ICIE 0 TCIE * Bit 7: Unimplemented, read as `0'. Individual interrupt is enabled by setting its associated control bit in the IOCF0 to "1". Global interrupt is enabled by the ENI instruction and is disabled by the DISI instruction. Refer to Fig. 11. * Bit 6 (CMPIE) CMPIF interrupt enable bit. 0: disable CMPIF interrupt 1: enable CMPIF interrupt * Bit 5 (PWM2IE) PWM2IF interrupt enable bit. 0: disable PWM2 interrupt 1: enable PWM2 interrupt * Bit 4 (PWM1IE) PWM1IF interrupt enable bit. 0: disable PWM1 interrupt 1: enable PWM1 interrupt * Bit 3 (ADIE) ADIF interrupt enable bit. 0: disable ADIF interrupt 1: enable ADIF interrupt * Bit 2 (EXIE) EXIF interrupt enable bit. 0: disable EXIF interrupt 1: enable EXIF interrupt * Bit 1 (ICIE) ICIF interrupt enable bit. 0: disable ICIF interrupt 1: enable ICIF interrupt * Bit 0 (TCIE) TCIF interrupt enable bit. 0: disable TCIF interrupt 1: enable TCIF interrupt IOCF0 register is both readable and writable. 11. IOC51 ( PWMCON ): 7 PWM2E 6 PWM1E 5 T2EN 4 T1EN 3 T2P1 2 T2P0 1 T1P1 0 T1P0 * Bit 7 (PWM2E): PWM2 enable bit 0 = PWM2 is off (default value), and its related pin carries out the P52 function. 1 = PWM2 is on, and its related pin will be set to output automatically. This specification is subject to change without prior notice. 18 06.25.2004 (V1.4) EM78P458/459 OTP ROM * Bit 6 (PWM1E): PWM1 enable bit 0 = PWM1 is off (default value), and its related pin carries out the P51 function; 1 = PWM1 is on, and its related pin will be set to output automatically. * Bit 5 (T2EN): TMR2 enable bit 0 = TMR2 is off (default value). 1 = TMR2 is on. * Bit 4 (T1EN): TMR1 enable bit 0 = TMR1 is off (default value). 1 = TMR1 is on. * Bit 3: Bit 2 ( T2P1:T2P0 ): TMR2 clock prescale option bits. T2P1 0 0 1 1 T1P1 0 0 1 1 T2P0 0 1 0 1 T1P0 0 1 0 1 Prescale 1:2(Default) 1:8 1:32 1:64 Prescale 1:2(Default) 1:8 1:32 1:64 * Bit 1 : Bit 0 ( T1P1:T1P0 ): TMR1 clock prescale option bits. 12. IOC61 ( DT1L: the Least Significant Byte ( Bit 7 ~ Bit 0) of Duty Cycle of PWM1 ) A specified value keeps the output of PWM1 to stay at high until the value matches with TMR1. 13. IOC71 ( DT1H: the Most Significant Byte ( Bit 1 ~ Bit 0 ) of Duty Cycle of PWM1 ) 7 CALI1 6 SIGN1 5 VOF1[2] 4 VOF1[1] 3 VOF1[0] 2 1 PWM1[9] 0 PWM1[8] * Bit 7 (CALI1): Calibration enable bit 0 = Calibration disable; 1 = Calibration enable. * Bit 6 (SIGN1): Polarity bit of offset voltage 0 = Negative voltage; 1 = Positive voltage. * Bit 5:Bit 3 (VOF1[2]:VOF1[0]): Offset voltage bits. * Bit 1:Bit 0 (PWM1[9]:PWM1[8]): The Most Significant Byte of PWM1 Duty Cycle A specified value keeps the PWM1 output to stay at high until the value matches with TMR1. This specification is subject to change without prior notice. 19 06.25.2004 (V1.4) EM78P458/459 OTP ROM 14. IOC81 ( PRD1: Period of PWM1 ): The content of IOC81 is a period (time base) of PWM1. The frequency of PWM1 is the reverse of the period. 15. IOC91 ( DT2L: the Least Significant Byte ( Bit 7 ~ Bit 0 ) of Duty Cycle of PWM2 ) A specified value keeps the of PWM1 output to stay at high until the value matches with TMR2. 16. IOCA1 ( DT2H: the Most Significant Byte ( Bit 1 ~ Bit 0 ) of Duty Cycle of PWM2 ) 7 CALI2 6 SIGN2 5 VOF2[2] 4 VOF2[1] 3 VOF2[0] 2 1 PWM2[9] 0 PWM2[8] * Bit 7 (CALI2): Calibration enable bit 0 = Calibration disable; 1 = Calibration enable. * Bit 6 (SIGN2): Polarity bit of offset voltage 0 = Negative voltage; 1 = Positive voltage. * Bit 5:Bit 3 (VOF2[2]:VOF2[0]): Offset voltage bits * Bit 1:Bit 0 (PWM2[9]:PWM2[8]): The Most Significant Byte of PWM1 Duty Cycle A specified value keeps the PWM2 output to stay at high until the value matches with TMR2. 17. IOCB1 ( PRD2: Period of PWM2 ) The content of IOCB1 is a period (time base) of PWM2. The frequency of PWM2 is the reverse of the period. 18. IOCC1 ( DL1L: the Least Significant Byte ( Bit 7 ~ Bit 0 ) of Duty Cycle Latch of PWM1 ) The content of IOCC1 is read-only. 19. IOCD1 ( DL1H: the Most Significant Byte ( Bit 1 ~ Bit 0 ) of Duty Cycle Latch of PWM1 ) The content of IOCD1 is read-only. 20. IOCE1 ( DL2L: the Least Significant Byte ( Bit 7 ~ Bit 0) of Duty Cycle Latch of PWM2 ) This specification is subject to change without prior notice. 20 06.25.2004 (V1.4) EM78P458/459 OTP ROM The content of IOCE1 is read-only. 21. IOCF1 ( DL2H: the Most Significant Byte ( Bit 1 ~ Bit 0 ) of Duty Cycle Latch of PWM2 ) The content of IOCF1 is read-only. This specification is subject to change without prior notice. 21 06.25.2004 (V1.4) EM78P458/459 OTP ROM 4.3 TCC/WDT & Prescaler An 8-bit counter is available as prescaler for the TCC or WDT. The prescaler is available for either the TCC or WDT only at any given time, and the PAB bit of CONT register is used to determine the prescaler assignment. The PSR0~PSR2 bits determine the prescale ratio. The prescaler is cleared each time the instruction is written to TCC under TCC mode. The WDT and prescaler, when assigned to WDT mode, are cleared by the WDTC or SLEP instructions. Fig. 5 depicts the circuit diagram of TCC/WDT. * R1(TCC) is an 8-bit timer/counter. The TCC clock source can be internal or external clock input (edge selectable from TCC pin). If TCC signal source is from internal clock, TCC will increase by 1 at every instruction cycle (without prescaler). Referring to Fig. 5, selection of CLK=Fosc/2 or CLK=Fosc/4 depends on the CODE Option bit CLKS. CLK=Fosc/2 if CLKS bit is "0", and CLK=Fosc/4 if CLKS bit is "1". * If TCC signal source is from external clock input, TCC will increase by 1 at every falling edge or rising edge of TCC pin. * The watchdog timer is a free running on-chip RC oscillator. The WDT will keep on running even after the oscillator driver has been turned off (i.e. in sleep mode). During normal operation or sleep mode, a WDT time-out (if enabled) will cause the device to reset. The WDT can be enabled or disabled at any time during the normal mode by software programming. Refer to WDTE bit of IOCE0 register. Without presacler, the WDT time-out period is approximately 18 ms1. 1 NOTE: VDD=5V,Setup time period = 18ms 30%. VDD=3V,Setup time period = 22ms 30%. This specification is subject to change without prior notice. 22 06.25.2004 (V1.4) EM78P458/459 OTP ROM CLK (Fosc/2 or Fosc/4) DATA BUS 0 TCC Pin 1 M U X TS 1 0 M U X PAB SYNC 2 cycles TCC (R1) TE TCC overflow interrupt 0 WDT 1 M U X PAB 0 8-bit Counter PSR0 ~ PSR2 8-to-1 MUX 1 WDTE (in IOCE) MUX WDT timeout PAB Fig. 5 Block Diagram of TCC and WDT 4.4 I/O Ports Port 5, Port 6, and the I/O registers are bi-directional tri-state I/O ports. The function of Pull-high, Pull-down, and Open-drain can be set internally by IOCB0, IOCC0, and IOCD0, respectively. Port 6 features an input status changed interrupt (or wake-up) function. Each I/O pin can be defined as "input" or "output" pin by the I/O control register (IOC50 ~ IOC60). The I/O registers and I/O control registers are both readable and writable. The I/O interface circuits for Port 5 and Port 6 are shown in the following Fig. 6, Fig. 7, and Fig. 8 respectively. This specification is subject to change without prior notice. 23 06.25.2004 (V1.4) EM78P458/459 OTP ROM PCRD Q D CLK C L _ Q PCWR PORT Q P R D PDWR IOD _ Q CLK C L PDRD 0 1 M U X NOTE: Pull-down is not shown in the figure. Fig. 6 The Ccircuit of I/O Port and I/O Control Register for Port 5 PCRD Q P R D _ Q CLK C L PCWR P50, /INT PORT Q P R D IOD _ Q CLK C L PDWR Bit 6 of IOCE0 D P R Q 0 1 CLK C L M U X _ Q PDRD TI 0 D P R Q CLK C L _ Q INT NOTE: Pull-high (down) and Open-drain are not shown in the figure. Fig. 7 The Circuit of I/O Port and I/O Control Register for P50(/INT) This specification is subject to change without prior notice. 24 06.25.2004 (V1.4) EM78P458/459 OTP ROM PCRD Q P R D _ Q CLK C L PCWR P60 ~ P67 PORT Q P R D IOD PDWR _ Q CLK C L 0 1 M U X PDRD TI n D P R Q CLK C L _ Q NOTE: Pull-high (down) and Open-drain are not shown in the figure. Fig. 8 The Circuit of I/O Port and I/O Control Register for P60~P67 IOCE.1 D P R Q Interrupt RE.1 ENI Instruction CLK _ CQ L T10 T11 P DRQ CLK _ C LQ P QRD CLK _ QC L T17 DISI Instruction Interrupt (Wake-up from SLEEP) /SLEP Next Instruction (Wake-up from SLEEP) Fig. 9 Block Diagram of Port 6 with Input Changed Interrupt/Wake-up This specification is subject to change without prior notice. 25 06.25.2004 (V1.4) EM78P458/459 OTP ROM Table 4 Usage of Port 6 Input Changed Wake-up/Interrupt Function Usage of Port 6 Input Status Changed Wake-up/Interrupt (I) Wake-up from Port 6 Input Status Change (II) Port 6 Input Status Change Interrupt (a) Before SLEEP 1. Read I/O Port 6 (MOV R6,R6) 1. Disable WDT 2. Execute "ENI" 2. Read I/O Port 6 (MOV R6,R6) 3. Enable interrupt (Set IOCF0.1) 3. Execute "ENI" or "DISI" 4. IF Port 6 changed (interrupt) 4. Enable interrupt (Set IOCF0.1) Interrupt vector (008H) 5. Execute "SLEP" instruction (b) After wake-up 1. IF "ENI" Interrupt vector (008H) 2. IF "DISI" Next instruction 4.5 RESET and Wake-up 1. The function of RESET and Wake-up A RESET is initiated by one of the following events(1) Power-on reset (2) /RESET pin input "low", or (3) WDT time-out (if enabled). The device is kept in a RESET condition for a period of approximately 18ms (one oscillator start-up timer period) after the reset is detected. Once the RESET occurs, the following functions are performed. * The oscillator is running, or will be started. * The Program Counter (R2) is set to all "0". * All I/O port pins are configured as input mode (high-impedance state). * The Watchdog Timer and prescaler are cleared. * When power is switched on, the upper 3 bits of R3 are cleared. * The bits of the CONT register are set to all "1" except for the Bit 6 (INT flag). * The bits of the IOCB0 register are set to all "1". * The IOCC0 register is cleared. * The bits of the IOCD0 register are set to all "1". * Bit 7 of the IOCE0 register is set to "1", and Bit 6 is cleared. * Bits 0~6 of RF register and bits 0~6 of IOCF0 register are cleared. Executing the "SLEP" instruction will assert the sleep (power down) mode. While entering sleep mode, the WDT (if enabled) is cleared but keeps on running. The controller can be awakened by(1) External reset input on /RESET pin. This specification is subject to change without prior notice. 26 06.25.2004 (V1.4) EM78P458/459 OTP ROM (2) WDT time-out (if enabled). (3) Port 6 input status change (if enabled). (4) Comparator high. (5) ADC complete. The first two cases will cause the EM78P458/459 to reset. The T and P flags of R3 can be used to determine the source of the reset (wake-up). Case 3 is considered the continuation of program execution and the global interrupt ("ENI" or "DISI" being executed) decides whether or not the controller branches to the interrupt vector following wake-up. If ENI is executed before SLEP, the instruction will begin to execute from the address 0x8 after wake-up. If DISI is executed before SLEP, the execution will restart from the instruction right next to SLEP after wake-up. Only one of the Cases 2, to 4 can be enabled before entering into sleep mode. That is, [a] if Port 6 Input Status Change Interrupt is enabled before SLEP , WDT must be disabled by software. However, the WDT bit in the option register remains enabled. Hence, the EM78P458/459 can be awakened only by Case 1 or 3. [b] if WDT is enabled before SLEP, Port 6 Input Status Changed Interrupt must be disabled. Hence, the EM78P458/459 can be awakened only by Case 1 or 2. Refer to the section on Interrupt for further details. [c] if Comparator High Interrupt is enabled before SLEP, WDT must be disabled by software. However, the WDT bit in the option register remains enabled. Hence, the EM78P458/459 can be awakened only by Case 1 or 4. If Port 6 Input Status Change Interrupt is used to wake up the EM78P458/459 (as in Case [a] above), the following instructions must be executed before SLEP: MOV A, @0Bxx000110 CONTW CLR R1 MOV A, @0Bxxxx1110 CONTW WDTC MOV A, @0B0xxxxxxx IOW RE MOV R6, R6 MOV A, @0B00000x1x IOW RF ; Read Port 6 ; Enable Port 6 input change interrupt ; Clear WDT and prescaler ; Disable WDT ; Clear TCC and prescaler ; Select WDT prescaler ; Select internal TCC clock This specification is subject to change without prior notice. 27 06.25.2004 (V1.4) EM78P458/459 OTP ROM ENI (or DISI) SLEP NOP ; Enable (or disable) global interrupt ; Sleep Similarly, if the Comparator High Interrupt is used to wake up the EM78P458/459 (as in Case [c] above), the following instructions must be executed before SLEP: MOV A, @0Bxx000110 CONTW CLR R1 MOV A, @0Bxxxx1110 CONTW WDTC MOV A, @0B0xxxxxxx IOW RE MOV A, @0B01xxxxxx IOW RF ENI (or DISI) SLEP NOP ; Enable (or disable) global interrupt ; Sleep ; Enable comparator high interrupt ; Clear WDT and prescaler ; Disable WDT ; Clear TCC and prescaler ; Select WDT prescaler ; Select internal TCC clock One problem user must be aware of, is that after waking up from the sleep mode, the WDT function will enable automatically. The WDT operation (being enabled or disabled) should be handled appropriately by software after waking up from the sleep mode. 2. The Status of T, and P of STATUS Register A RESET condition is initiated by one of the following events: (1) A power-on condition, (2) A high-low-high pulse on /RESET pin, or (3) Watchdog Timer time-out. The values of T and P, as listed in Table 5 below, are used to check how the processor wakes up. Table 6 shows the events, which may affect the status of T and P. This specification is subject to change without prior notice. 28 06.25.2004 (V1.4) EM78P458/459 OTP ROM Table 5 The Values of RST, T, and P after RESET Reset Type Power-on /RESET during Operating mode /RESET wake-up during SLEEP mode WDT during Operating mode WDT wake-up during SLEEP mode Wake-up on pin change during SLEEP mode *P: Previous status before reset Table 6 The Status of RST, T and P being Affected by Events Event Power-on WDTC instruction WDT time-out SLEP instruction Wake-up on pin changed during SLEEP mode *P: Previous value before reset T 1 1 0 1 1 P 1 1 *P 0 0 T 1 *P 1 0 0 1 P 1 *P 0 *P 0 0 VDD D Oscillator CLK CLR Power-On Reset Voltage Detector Q CLK W WDT Timeout WDT /RESET Setup time Reset Fig. 10 Block Diagram of Reset of Controller This specification is subject to change without prior notice. 29 06.25.2004 (V1.4) EM78P458/459 OTP ROM 4.6 Interrupt The EM78P458/459 has six interrupts as listed below: (1) TCC overflow interrupt (2) Port 6 Input Status Change Interrupt (3) External interrupt [(P50, /INT) pin]. (4) Analog to Digital conversion completed. (5) When TMR1/TMR2 matches with PRD1/PRD2 respectively in PWM. (6) When the comparators output change. Before the Port 6 Input Status Change Interrupt is enabled, reading Port 6 (e.g. "MOV R6,R6") is necessary. Each Port 6 pin will have this feature if its status changes. Any pin configured as output or P50 pin configured as /INT, is excluded from this function. Port 6 Input Status Change Interrupt will wake up the EM78P458/459 from the sleep mode if it is enabled prior to going into the sleep mode by executing SLEP. When the controller is wake-up, it will continue to execute the succeeding program if the global interrupt is disabled, or branches out to the interrupt vector 008H if the global interrupt is enabled. RF, the interrupt status register that records the interrupt requests in the relative flags/bits. IOCF0 is an interrupt mask register. The global interrupt is enabled by the ENI instruction and is disabled by the DISI instruction. When one of the interrupts (when enabled) occurs, the next instruction will be fetched from address 008H. Once in the interrupt service routine, the source of an interrupt can be determined by polling the flag bits in RF. The interrupt flag bit must be cleared by instructions before leaving the interrupt service routine to avoid recursive interrupts. The flag (except ICIF bit) in the Interrupt Status Register (RF) is set regardless of the status of its mask bit or the execution of ENI. Note that the outcome of RF will be the logic AND of RF and IOCF0 (refer to Fig. 11). The RETI instruction ends the interrupt routine and enables the global interrupt (the execution of ENI). When an interrupt is generated by the INT instruction (when enabled), the next instruction will be fetched from address 001H. This specification is subject to change without prior notice. 30 06.25.2004 (V1.4) EM78P458/459 OTP ROM Fig. 11 Interrupt Input Circuit 4.7 Analog-To-Digital Converter (ADC) The analog-to-digital circuitry consists of an 8-bit analog multiplexer, three control registers (ADCON/R9, AD-CMP-CON/IOCA0, GCON/IOC90), one data register (ADDATA/RA) and an ADC with 8-bit resolution. The functional block diagram of the ADC is shown in Fig. 12. The analog reference voltage (Vref) and analog ground are connected via separate input pins. The ADC module utilizes successive approximation to convert the unknown analog signal into a digital value. The result is fed to the ADDATA. Input channels are selected by the analog input multiplexer via the ADCON register Bits ADIS0, ADIS1, and ADIS2. ADC8 ADC7 8-1 Analog Switch ADC6 ADC5 + OP2 - Vref ADC ( successive approximation ) Fsco Power-Down Start to Convert ADC4 ADC3 ADC2 ADC1 + OP1 - 4-1 MUX Internal RC 4 3 2 5 4 3 2 1 0 2 1 0 1 0 RF 3 7 6 5 4 3 2 1 0 4 ADCON 3 AD-CMPCON GCON ADCON AD-CMPCON ADDATA DATA BUS Fig. 12 The Functional Block Diagram of Analog-to-Digital Conversion This specification is subject to change without prior notice. 31 06.25.2004 (V1.4) EM78P458/459 OTP ROM 1. ADC Control Register (ADCON/R9, AD-CMP-CON/IOCA0, GCON/IOC90) 1.1 ADCON/R9 The ADCON register controls the operation of the A/D conversion and decides which pin should be currently active. BIT SYMBOL *Init_Value 7 0 6 0 5 IOCS 0 4 ADRUN 0 3 ADPD 0 2 ADIS2 0 1 ADIS1 0 0 ADIS0 0 *Init_Value: Initial value at power on reset * ADRUN (bit 4): ADC starts to RUN. 1 = an A/D conversion is started. This bit can be set by software. 0 = reset on completion of the conversion. This bit can not be reset in software. * ADPD (bit 3): ADC Power-down Mode. 1 = ADC is operating; 0 = switch off the resistor reference to save power even when the CPU is operating. * ADIS2~ADIS0 (bit 2~0): Analog Input Select. 000 = AN0; 001 = AN1; 010 = AN2; 011 = AN3; 100 = AN4; 101 = AN5; 110 = AN6; 111 = AN7; Change occurs only when the ADIF bit and the ADRUN bit are both LOW. 1.2 AD-CMP-CON/IOCA0 The AD-CMP-CON register defines the pins of Port 6 as analog inputs or as digital I/O, individually. BIT SYMBOL *Init_Value 7 VREFS 0 6 CE 0 5 COE 0 4 IMS2 0 3 IMS1 0 2 IMS0 0 1 CKR1 0 0 CKR0 0 *Init_Value: Initial value at power on reset * VREFS (Bit 7): The input source of the Vref of the ADC. 0 = The Vref of the ADC is connected to Vdd (default value), and the P53/VREF pin carries out the function of P53; This specification is subject to change without prior notice. 32 06.25.2004 (V1.4) EM78P458/459 OTP ROM 1 = The Vref of the ADC is connected to P53/VREF. * CE (Bit 6): Control bit used to enable comparator. 0 = Disable comparator 1 = Enable comparator * COE (Bit 5): Set P57 as the output of the comparator 0 = the comparator acts as an OP if CE=1. 1 = act as a comparator if CE=1. * IMS2~IMS0 (Bit 4 ~ Bit 2): ADC configuration definition bit. * CKR1 and CKR0 (Bit 1 and Bit 0): The conversion time select. 00 = Fosc/4; 01 = Fosc/16; 10 = Fsco/64; 11 = The oscillator clock source of ADC is from WDT ring oscillator frequency. ( frequency=256/18msU 1.3 GCON/IOC90 As shown in Fig. 12, OP1 and OP2, the gain amplifiers, are located in the middle of the analog input pins (ADC1 and ADC5) and the 8-1analog switch. The GCON register controls the gains. Table 7 Table 7 Shows the Gains and the Operating Range of ADC. BIT SYMBOL *Init_Value 7 OP2E 0 6 OP1E 0 5 G22 0 4 G21 0 3 G20 0 2 G12 0 1 G11 0 0 G10 0 14.2Khz) Table 8 The Gains and the Operating Range of ADC G10:G12/G20:G22 000 001 010 011 100 101 Gain 1 2 4 8 16 32 Range of Operating Voltage 0 ~ Vref 0 ~ (1/2)Vref 0 ~ (1/4)Vref 0 ~ (1/8)Vref 0 ~ (1/16)Vref 0 ~ (1/32)Vref 2. ADC Data Register (ADDATA/RA) When the A/D conversion is complete, the result is loaded to the ADDATA. The START/END bit is clear, and the ADIF is set. This specification is subject to change without prior notice. 33 06.25.2004 (V1.4) EM78P458/459 OTP ROM 3. A/D Sampling Time The accuracy, linearity, and speed of the successive approximation A/D converter are dependent on the properties of the ADC and the comparator. The source impedance and the internal sampling impedance directly affect the time required to charge the sample holding capacitor. The application program controls the length of the sample time to meet the specified accuracy. Generally speaking, the program should wait for 1 g s for each K of the analog source impedance and at least 1 g s for the low-impedance source. After the analog input channel is selected, this acquisition time must be done before the conversion can be started. 4. A/D Conversion Time CKR0 and CKR1 select the conversion time (Tct), in terms of instruction cycles. This allows the MCU to run at the maximum frequency without sacrificing the accuracy of A/D conversion. For the EM78P458/459, the conversion time per bit is about 4g s. Table 8 shows the relationship between Tct and the maximum operating frequencies. Table 9 Tct vs. the Maximum Operation Frequency CKR0:CKR1 00 01 10 11 Operation Mode Fsco/4 Fsco/16 Fsco/64 Internal RC Max. operation frequency 1 MHz 4 MHz 16MHz - 5. A/D Operation During Sleep Mode In order to reduce power consumption, the A/D conversion remains operational during sleep mode, and is obligated to implement the internal RC clock source mode. As the SLEP instruction is executed, all the operations of the MCU will stop except for the A/D conversion. The RUN bit will be cleared and the result will be fed to the ADDATA when the conversion is completed. If the ADIE is enabled, the device will wake up. Otherwise, the A/D conversion will be shut off, no matter what the status of ADPD bit is. 6. Programming Steps/Considerations 1. Programming steps Follow these steps to obtain data from the ADC: (1) Write to the three bits (IMS2:IMS0) on the AD-CMP-CON1 register to define the characteristics of R6: Digital I/O, analog channels, and voltage reference pin; (2) Write to the ADCON register to configure AD module: This specification is subject to change without prior notice. 34 06.25.2004 (V1.4) EM78P458/459 OTP ROM (a) Select A/D input channel ( ADAS2:ADAS0 ); (b) Select the proper gains by writing to the GCON register ( optional ); (c) Define A/D conversion clock rate ( CKR1:CKR0 ); (d) Set the ADPD bit to 1 to begin sampling. (3) Put "ENI" instruction, if the interrupt function is employed. (4) Set the ADRUN bit to 1. (5) Wait for either the interrupt flag to be set or the ADC interrupt to occur. (6) Read ADDATA, the conversion data register. (7) Clear the interrupt flag bit (ADIF). (8) For next conversion, go to Step 1 or Step 2 as required. At least 2 Tct is required before next acquisition starts. ; To define the general registers R_0 == 0 PSW == 3 PORT5 == 5 PORT6 == 6 R_F== 0XF ; Interrupt status register ; Indirect addressing register ; Status register ; To define the control register IOC50 == 0X5 IOC60 == 0X6 C_INT== 0XF ; Control Register of Port 5 ; Control Register of Port 6 ; Interrupt Control Register ;ADC Control Registers ADDATA == 0xA ; The contents are the results of ADC ADCON R== 0x9 ;7 6 5 35 4 3 2 1 0 06.25.2004 (V1.4) This specification is subject to change without prior notice. EM78P458/459 OTP ROM ;ADCONC== 0xA ;7 ; VREFS GCON == 0x9 ;7 ; OPE2 ;To define bits ;In ADCONR ADRUN == 0x4 ADPD == 0x3 6 X 6 IOCS ADRUN ADPD ADIS2 ADIS1 ADIS0 5 X 5 4 3 2 1 0 IMS2 IMS1 4 G21 3 G20 IMS0 CKR1 CKR0 2 G12 1 G11 0 G10 OPE1 G22 ; ADC is executed as the bit is set ; Power Mode of ADC ORG 0 JMP INITIAL ; Initial address ; ORG 0x08 ; Interrupt vector (User program) CLR R_F BS ADCONR, ADRUN RETI INITIAL: MOV A, @0BXXXX1XXX IOW C_INT MOV A, @0xXX CONTW MOV A, @0B00000000 IOW ADCONC En_ADC: ; To clear the ADCIF bit ; To start to execute the next AD conversion if necessary ; Enable the interrupt function of ADC, "X" by application ; Interrupt disabled:<6> ; To employ Vdd as the reference voltage, to define P60 as ; an analog input and set clock rate at fosc/4 This specification is subject to change without prior notice. 36 06.25.2004 (V1.4) EM78P458/459 OTP ROM MOV A, @0BXXXXXXX1 IOW PORT6 MOV A, @0B01000101 IOW GCON BS ADCONR, ADPD ENI BS ADCONR, ADRUN ; To define P60 as an input pin, and the others are dependent ; on applications ; To enable the OP1, and set the gain as 32 ; To disable the power-down mode of ADC ; Enable the interrupt function ; Start to run the ADC ; If the interrupt function is employed, the following three lines may be ignored POLLING: JBC ADCONR, ADRUN JMP POLLING (User program) : : : ; To check the ADRUN bit continuously; ; ADRUN bit will be reset as the AD conversion is completed 4.8 Dual Sets of PWM ( Pulse Width Modulation ) 1. Overview In PWM mode, both PWM1 and PWM2 pins produce up to a 10-bit resolution PWM output (see. Fig. 13 for the functional block diagram). A PWM output has a period and a duty cycle, and it keeps the output in high. The baud rate of the PWM is the inverse of the period. Fig. 14 depicts the relationships between a period and a duty cycle. This specification is subject to change without prior notice. 37 06.25.2004 (V1.4) EM78P458/459 OTP ROM DL1H + DL1L latch To PW M 1IF Fosc 1:2 1:8 1:32 1:64 DT1H + DT1L Com parator M UX Duty Cycle M atch PW M 1 R Q TM R1H + TM R1L reset S IOC51 Com parator T1P0 T1P1 T1EN Period M atch PRD1 Data Bus DL2H + DL2L latch Data Bus To PW M 2IF T2P0 T2P1 T2EN DT2H + DT2L Com parator Duty Cycle M atch PW M 2 Fosc 1:2 1:8 1:32 1:64 TM R2H + TM R2L reset R S Q M UX Com parator Period M atch IOC51 PRD2 Fig. 13 The Functional Block Diagram of the Dual PWMs Period Duty Cycle DT1 = TMR1 PRD1 = TMR1 Fig. 14 The Output Timing of the PWM 2. Increment Timer Counter ( TMRX: TMR1H/TWR1L or TMR2H/TWR2L ) TMRX are ten-bit clock counters with programmable prescalers. They are designed for the PWM module as baud rate clock generators. TMRX can be read, written, and cleared at any reset conditions. If employed, they can be turned down for power saving by setting T1EN bit [PWMCON<4>] or T2EN bit [PWMCON<5>] to 0. 3. PWM Period ( PRDX : PRD1 or PRD2 ) The PWM period is defined by writing to the PRDX register. When TMRX is equal to PRDX, the This specification is subject to change without prior notice. 38 06.25.2004 (V1.4) EM78P458/459 OTP ROM following events occur on the next increment cycle: * TMRX is cleared. * The PWMX pin is set to 1. * The PWM duty cycle is latched from DT1/DT2 to DTL1/DTL2. < Note > The PWM output will not be set, if the duty cycle is 0; * The PWMXIF pin is set to 1. The following formula describes how to calculate the PWM period: PERIOD = (PRDX + 1) * 4 * (1/Fosc) * (TMRX prescale value ) 4. PWM Duty Cycle ( DTX: DT1H/ DT1L and DT2H/ DT2L; DTL: DL1H/DL1L and DL2H/DL2L ) The PWM duty cycle is defined by writing to the DTX register, and is latched from DTX to DLX while TMRX is cleared. When DLX is equal to TMRX, the PWMX pin is cleared. DTX can be loaded at any time. However, it cannot be latched into DTL until the current value of DLX is equal to TMRX. The following formula describes how to calculate the PWM duty cycle: Duty Cycle = (DTX) * (1/Fosc) * (TMRX prescale value ) 5. Comparator X To change the output status while the match occurs, the TMRXIF flag will be set at the same time. 6. PWM Programming Procedures/Steps (1) Load PRDX with the PWM period.. (2) Load DTX with the PWM Duty Cycle. (3) Enable interrupt function by writing IOCF0, if required. (4) Set PWMX pin to be output by writing a desired value to IOC51. (5) Load a desired value to IOC51 with TMRX prescaler value and enable both PWMX and TMRX. This specification is subject to change without prior notice. 39 06.25.2004 (V1.4) EM78P458/459 OTP ROM 4.9 Timer 1. Overview Timer1 (TMR1) and Timer2 (TMR2) (TMRX) are 10-bit clock counters with programmable prescalers, respectively. They are designed for the PWM module as baud rate clock generators. TMRX can be read, written, and cleared at any reset conditions. 2. Function description Fig. 15 shows TMRX block diagram. Each signal and block are described as follows: Fosc 1:2 1:8 1:32 1:64 To PWM1IF MUX TMR1X reset Period Match Comparator T1P0 T1P1 T1EN PRD1 Data Bus Data Bus PRD2 T2P0 T2P1 T2EN Comparator Period Match Fosc 1:2 1:8 1:32 1:64 TMR2X MUX reset To PWM2IF *TMR1X = TMR1H + TMR1L; *TMR2X = TMR2H +TMR2L Fig. 15 TMRX Block Diagram Fosc: Input clock. Prescaler ( T1P0 and T1P1/T2P1 and T2P0 ): Options of 1:2, 1:8, 1:32, and 1:64 are defined by TMRX. It is cleared when any type of reset occurs. TMR1X and TMR2X (TMR1H/TWR1L and TMR2H/TMR2L ): Timer X register; TMRX is increased until it matches with PRDX, and then is reset to 0. TMRX cannot be read. PRDX ( PRD1 and PRD2 ): PWM period register. ComparatorX ( Comparator 1 and Comparator 2 ): To reset TMRX while a match occurs and the TMRXIF flag is set at the same time. This specification is subject to change without prior notice. 40 06.25.2004 (V1.4) EM78P458/459 OTP ROM 3. Programming the Related Registers When defining TMRX, refer to the related registers of its operation as shown in Table 9.It must be noted that the PWMX bits must be disabled if their related TMRXs are employed. That is, bit 7 and bit 6 of the PWMCON register must be set to `0'. Table 10 Related Control Registers of TMR1 and TMR2 Address Name IOC51 PWMCON/IOC51 Bit 7 PWM2E Bit 6 PWM1E Bit 5 T2EN Bit 4 T1EN Bit 3 T2P1 Bit 2 T2P0 Bit 1 Bit 0 T1P1 T1P0 4. Timer programming procedures/steps (1) Load PRDX with the TIMER period. (2) Enable interrupt function by writing IOCF0, if required (3) Load a desired value to PWMCON with the TMRX prescaler value and enable both TMRX and disable PWMX. 4.10 Comparator EM78P458/459 has one comparator, which has two analog inputs and one output. The comparator can be employed to wake up from the sleep mode. Fig. 16 shows the circuit of the comparator. CinCin+ CMP + CO Fig. 16 Comparator Operating Mode 1. External Reference Signal The analog signal that is presented at Cin- compares to the signal at Cin+, and the digital output (CO) of the comparator is adjusted accordingly. * The reference signal must be between Vss and Vdd. * The reference voltage can be applied to either pi of comparator. * Threshold detector applications may be of the same reference. * The comparator can operate from the same or different reference source. 2. Comparator Outputs * The compared result is stored in the CMPOUT of R3. * The comparator outputs is output to P57 by programming bit5 This specification is subject to change without prior notice. 41 06.25.2004 (V1.4) EM78P458/459 OTP ROM * P57 must be defined as an output if implemented as the comparator output. * Fig. 17 shows the comparator output block diagram. To C0 From OP I/O CMRD EN EN Q To CMPOUT D Q D RESET To CPIF CMRD From other comparator Fig. 17 The Output Configuration of a Comparator 3. Using as An Operation Amplifier The comparator can be used as an operation amplifier if a feedback resistor is connected from the input to the output externally. In this case, the Schmitt trigger can be disabled for power saving by setting CE to 1 and COE to 0. 4. Interrupt * CMPIE (IOCF0.6) must be enabled. * Interrupt occurs at the rising edge of the comparator output pin. * The actual change on the pin can be determined by reading the Bit CMPOUT, R3<7>. * CMPIF (RF.6), the comparator interrupt flag, can only be cleared by software. 5. Wake-up from SLEEP Mode * If enabled, the comparator remains active and the interrupt remains functional, even under SLEEP mode. * If a mismatch occurs, the interrupt will wake up the device from SLEEP mode. * The power consumption should be taken into consideration for the benefit of energy conservation. * If the function is unemployed during SLEEP mode, turn off comparator before entering into sleep mode. This specification is subject to change without prior notice. 42 06.25.2004 (V1.4) EM78P458/459 OTP ROM 4.11 The Initialized Values after Reset Table 11 The Summary of the Initialized Values for Registers Address N/A Name IOC50 Reset Type Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Bit 7 C57 1 1 P C67 1 1 P /PD7 1 1 P OD7 1 1 P /PH7 1 1 P WDTE 1 1 P X 0 0 0 OP2E 0 0 P VREFS 0 0 P PWM2E 0 0 P Bit7 0 0 P CALI1 0 0 P 0 0 P Bit7 0 0 P CALI2 Bit 6 C56 1 1 P C66 1 1 P /PD6 1 1 P OD6 1 1 P /PH6 1 1 P EIS 0 0 P CMPIE 0 0 P OP1E 0 0 P CE 0 0 P PWM2E 0 0 P Bit6 0 0 P SIGN1 1 1 P 0 0 P Bit6 0 0 P SIGN2 Bit 5 C55 1 1 P C65 1 1 P */PD5 1 1 P OD5 1 1 P /PH5 1 1 P X 1 1 1 PMW2IE 0 0 P G22 0 0 P COE 0 0 P T2EN 0 0 P Bit5 0 0 P VOF1[2] 1 1 P 0 0 P Bit5 0 0 P VOF2[2] Bit 4 C54 1 1 P C64 1 1 P */PD4 1 1 P OD4 1 1 P /PH4 1 1 P X 1 1 1 PWM1IE 0 0 P G21 0 0 P IMS2 0 0 P T1EN 0 0 P Bit4 0 0 P VOF1[1] 0 0 P 0 0 P Bit4 0 0 P VOF2[1] Bit 3 C53 1 1 P C63 1 1 P /PD3 1 1 P OD3 1 1 P /PH3 1 1 P X 1 1 1 ADIE 0 0 P G20 0 0 P IMS1 0 0 P T2P1 0 0 P Bit3 0 0 P VOF1[0] 0 0 P 0 0 P Bit3 0 0 P VOF2[0] Bit 2 C52 1 1 P C62 1 1 P /PD2 1 1 P OD2 1 1 P /PH2 1 1 P X 1 1 1 EXIE 0 0 P G12 0 0 P IMS0 0 0 P T2P0 0 0 P Bit2 0 0 P X 0 0 0 0 0 P Bit2 0 0 P X Bit 1 C51 1 1 P C61 1 1 P /PD1 1 1 P OD1 1 1 P /PH1 1 1 P X 1 1 1 ICIE 0 0 P G11 0 0 P CKR1 0 0 P T1P1 0 0 P Bit1 0 0 P Bit1 0 0 P 0 0 P Bit1 0 0 P Bit1 Bit 0 C50 1 1 P C60 1 1 P /PD0 1 1 P OD0 1 1 P /PH0 1 1 P X 1 1 1 TCIE 0 0 P G10 0 0 P CKR0 0 0 P T1P0 0 0 P Bit0 0 0 P Bit0 0 0 P 0 0 P Bit0 0 0 P Bit0 N/A IOC60 N/A IOCB0 N/A IOCC0 N/A IOCD0 N/A IOCE0 N/A IOCF0 N/A IOC90 (GCON) N/A IOCA0 (AD-CMP CON) N/A IOC51 (PWMCON) N/A IOC61 (DT1L) N/A IOC71 (DT1H) N/A IOC81 (PRD1) N/A IOC91 (DT2L) IOCA1 N/A This specification is subject to change without prior notice. 43 06.25.2004 (V1.4) EM78P458/459 OTP ROM Address Name (DT2H) Reset Type Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Bit 7 0 0 P 0 0 P Bit7 0 0 P X 0 0 0 Bit7 0 0 P X 0 0 0 INTE 1 1 P U P P 0 0 P 0 0 GP2 0 0 P BS7 0 0 P P57 1 1 P P67 1 1 P U P P X 0 0 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 1 1 0 0 0 0 1 1 0 0 0 0 P P P P 0 P 0 0 0 0 0 0 0 0 0 0 0 0 P P P P P P Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 0 0 0 0 0 0 0 0 0 0 0 0 P P P P P P X X X X X Bit1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 P Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 0 0 0 0 0 0 0 0 0 0 0 0 P P P P P P X X X X X Bit1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 P INT TS TE PAB PSR2 PSR1 0 1 1 1 1 1 0 1 1 1 1 1 P P P P P P U U U U U U P P P P P P P P P P P P 0 0 0 0 0 0 0 0 0 0 0 0 P P P P P P 0 0 0 0 0 0 0 0 0 0 0 0 Jump to address 0x08 or continue to execute next instruction PS1 PS0 T P Z DC 0 0 1 1 U U 0 0 t t P P P P t t P P BS6 0 U U U U U 0 P P P P P P P P P P P P56 P55 P54 P53 P52 P51 1 1 1 1 1 1 1 1 1 1 1 1 P P P P P P P66 P65 P64 P63 P62 P61 1 1 1 1 1 1 1 1 1 1 1 1 P P P P P P U U U U U U P P P P P P P P P P P P X IOCS ADRUN ADPD ADAS2 ADAS1 0 0 0 0 0 0 0 0 0 0 0 0 Bit 0 0 0 P 0 0 P Bit0 0 0 P Bit0 0 0 P Bit0 0 0 P Bit0 0 0 P PSR0 1 1 P U P P 0 0 P 0 0 C U P P U P P P50 1 1 P P60 1 1 P U P P ADAS0 0 0 N/A IOCB1 (PRD2) N/A IOCC1 (DL1L) N/A IOCD1 (DL1H) N/A IOCE1 (DL2L) N/A IOCF1 (DL2H) N/A CONT 0x00 R0(IAR) 0x01 R1(TCC) 0x02 R2(PC) 0x03 R3(SR) 0x04 R4(RSR) 0x05 P5 0x06 P6 0x7~0x8 R7~R8 0x9 R9 (ADCON) This specification is subject to change without prior notice. 44 06.25.2004 (V1.4) EM78P458/459 OTP ROM Address Name Reset Type Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit Name Power-on /RESET and WDT Wake-up from Pin Changed Bit 7 P 0 0 P Bit7 0 0 P X 0 0 0 Bit7 0 0 P X 0 0 0 X 0 0 0 U P P Bit 6 P 0 0 P Bit6 0 0 P X 0 0 0 Bit6 0 0 P X 0 0 0 CMPIF 0 0 P U P P Bit 5 P 0 0 P Bit5 0 0 P X 0 0 0 Bit5 0 0 P X 0 0 0 PWM2IF 0 0 P U P P Bit 4 P 0 0 P Bit4 0 0 P X 0 0 0 Bit4 0 0 P X 0 0 0 PWM1IF 0 0 P U P P Bit 3 P 0 0 P Bit3 0 0 P X 0 0 0 Bit3 0 0 P X 0 0 0 ADIF 0 0 P U P P Bit 2 P 0 0 P Bit2 0 0 P X 0 0 0 Bit2 0 0 P X 0 0 0 EXIF 0 0 P U P P Bit 1 P 0 0 P Bit1 0 0 P Bit1 0 0 P Bit1 0 0 P Bit1 0 0 P ICIF 0 0 P U P P Bit 0 P 0 0 P Bit0 0 0 P Bit0 0 0 P Bit0 0 0 P Bit0 0 0 P TCIF 0 0 P U P P 0xA RA (ADDDATA) 0xB RB (TMR1L) 0xC RC (TMR1H) 0xD RD (TMR2L) 0xE RE (TMR2H) 0xF RF (ISR) 0x10~0x3F R10~R3F X: not used. U: unknown or don't care. t: check Table 5 P: previous value before reset. 4.12 Oscillator 1. Oscillator Modes The EM78P458 and EM78P459 can be operated in four different oscillator modes, such as High XTAL oscillator mode (HXT), Low XTAL oscillator mode (LXT), External RC oscillator mode (ERC), and RC oscillator mode with Internal capacitor (IC). Users can select one of them by programming the MASK Option. The up-limited operation frequency of crystal/resonator on the different VDDs is listed in Table 11. Table 12 The Summary of Maximum Operating Speeds Conditions Two clocks VDD 2.3 3.0 5.0 Fxt max.(MHz) 4 8 20 2. Crystal Oscillator/Ceramic Resonators (XTAL) EM78P458/459 can be driven by an external clock signal through the OSCI pin as shown in Fig. 18 This specification is subject to change without prior notice. 45 06.25.2004 (V1.4) EM78P458/459 OTP ROM below. OSCI EM78P458 EM78P459 Ext. Clock OSCO Fig. 18 Circuit for External Clock Input In the most applications, pin OSCI and pin OSCO can be connected with a crystal or ceramic resonator to generate oscillation. Fig. 19 depicts such circuit. The same applies to the HXT mode and the LXT mode. Table 12 provided the recommended values of C1 and C2. Since each resonator has its own attribute, user should refer to their specifications for appropriate values of C1 and C2. RS, a serial resistor, may be necessary for AT strip cut crystal or low frequency mode. C1 OSCI EM78P458 EM78P459 OSCO RS C2 XTAL Fig. 19 Circuit for Crystal/Resonator Table 13 Capacitor Selection Guide for Crystal Oscillator or Ceramic Resonators Oscillator Type Ceramic Resonators Frequency Mode HXT Frequency 455 kHz 2.0 MHz 4.0 MHz 32.768kHz 100KHz 200KHz 455KHz 1.0MHz 2.0MHz 4.0MHz C1(pF) 100~150 20~40 10~30 25 25 25 20~40 15~30 15 15 C2(pF) 100~150 20~40 10~30 15 25 25 20~150 15~30 15 15 LXT Crystal Oscillator HXT 3. External RC Oscillator Mode For some applications that do not require precise timing calculation, the RC oscillator (Fig. 20) could This specification is subject to change without prior notice. 46 06.25.2004 (V1.4) EM78P458/459 OTP ROM offer users with an effective cost savings. Nevertheless, it should be noted that the frequency of the RC oscillator is influenced by the supply voltage, the values of the resistor (Rext), the capacitor(Cext), and even by the operation temperature. Moreover, the frequency also changes slightly from one chip to another due to the manufacturing process variation. In order to maintain a stable system frequency, the values of the Cext should not be less than 20pF, and that the value of Rext should not be greater than 1M ohm. If they cannot be kept in this range, the frequency can be affected easily by noise, humidity, and leakage. The smaller the Rext in the RC oscillator, the faster its frequency will be. On the contrary, for very low Rext values, for instance, 1 K, the oscillator becomes unstable because the NMOS cannot discharge the current of the capacitance correctly. Based on the above reasons, it must be kept in mind that all supply voltage, the operation temperature, the components of the RC oscillator, the package types, and the way the PCB is layout, have certain effect on the system frequency. Vcc Rext OSCI Cext EM78P458 EM78P459 Fig. 20 Circuit for External RC Oscillator Mode Table 14 RC Oscillator Frequencies Cext Rext 3.3k 5.1k 10k 100k 3.3k 5.1k 10k 100k Average Fosc 5V,25C 3.57 MHz 2.63MHz 1.30 MHz 150 KHz 1.43 MHz 980 KHz 520 KHz 57 KHz Average Fosc 3V,25C 2.94 MHz 1.92 MHz 1.22 MHz 153 KHz 1.35 MHz 877 KHz 465 KHz 54 KHz 20 pF 100 pF This specification is subject to change without prior notice. 47 06.25.2004 (V1.4) EM78P458/459 OTP ROM 3.3k 5.1k 10k 100k 510 KHz 340 KHz 175 KHz 19 KHz 470 KHz 320 KHz 170 KHz 19 KHz 300 pF 1. Measured on DIP packages. 2. Design reference only 4. RC Oscillator Mode with Internal Capacitor If both precision and cost are taken into consideration, EM78P257A/B also offers a special oscillation mode. It is equipped with an internal capacitor and an external resistor (connected to Vcc). The internal capacitor functions as temperature compensator. In order to obtain more accurate frequency, a precise resistor is recommended. Vcc Rext OSCI EM78P458 EM78P459 Fig. 21 Circuit for Internal C Oscillator Mode Table 15 R Oscillator Frequencies Rext 51k 100k 300k 4.13 Power-on Considerations Any microcontroller is not warranted to start proper operation before the power supply stabilizes in steady state. EM78P458/459 POR voltage range is 1.2V~1.8V. Under customer application, when power is OFF, Vdd must drop to below 1.2V and remains OFF for 10us before power can be switched ON again. This way, the EM78P458/459 will reset and work normally. The extra external reset circuit will work well if Vdd can rise at very fast speed (50 ms or less). However, under most cases where critical This specification is subject to change without prior notice. 48 06.25.2004 (V1.4) EM78P458/459 OTP ROM applications are involved, extra devices are required to assist in solving the power-up problems. 1. External Power on Reset Circuit The circuit shown in Fig. 22 implements an external RC to produce a reset pulse. The pulse width (time constant) should be kept long enough to allow Vdd to reach minimum operation voltage. This circuit is used when the power supply has a slow rise time. Because the current leakage from the /RESET pin is about 5A, it is recommended that R should not be great than 40 K. In this way, the voltage at Pin /RESET is held below 0.2V. The diode (D) acts as a short circuit at power-down. The capacitor, C, is discharged rapidly and fully. Rin, the current-limited resistor, prevents high current discharge or ESD (electrostatic discharge) from flowing into Pin /RESET. VDD /RESET EM78P458 EM78P459 R D Rin C Fig. 22 External Power on Reset Circuit 2. Residue-Voltage Protection When battery is replaced, device power (Vdd) is taken off but residue-voltage remains. The residue-voltage may trips below Vdd minimum, but not to zero. This condition may cause a poor power on reset. Fig. 23 and Fig. 24 show how to build a residue-voltage protection circuit VDD EM78P458 EM78P459 /RESET 100K 1N4684 33K Q1 10K VDD Fig. 23 Circuit 1 for the Residue Voltage Protection 49 06.25.2004 (V1.4) This specification is subject to change without prior notice. EM78P458/459 OTP ROM VDD EM78P458 EM78P459 /RESET R3 R2 R1 Q1 VDD Fig.24 Circuit 2 for the Residue Voltage Protection 4.14 CODE OPTION EM78P458/459 has one CODE option word and one Customer ID word that are not a part of the normal program memory. Word 0 Bit12~Bit0 Code option12~0 Word 1 Bit12~Bit0 Code option12~0 1. Code Option Register (Word 0) Bit12 MS 0: RC type 1: XTAL type * Bit 11 (/ENWTD): Watchdog timer enable bit. 0: Enable 1: Disable * Bit 10 (CLKS): Clocks of each instruction cycle. 0: Two clocks 1: Four clocks Refer to the section of Instruction Set. * Bit 9 (/PTB): Protect bit. 0: Enable 1: Disable * Bit 8 (HLF): XTAL frequency selection. 0: Low frequency Bit11 /ENWDT Bit10 CLKS Bit9 /PTB Bit8 HLF Bit7 RCT Bit6 HLP Bit5~Bit0 ID * Bit 12 (MS): Oscillator type selection. This specification is subject to change without prior notice. 50 06.25.2004 (V1.4) EM78P458/459 OTP ROM 1: High frequency * Bit 7 (RCT): Resistor Capacitor 0: Inter C, External R 1: External RC * Bit 6 (HLP): Power consumption selection. 0: Low power. 1: High power. * Bit 5 ~ Bit 0 (ID[5]~ID[0]): Customer's ID. 2. Code Option Register (Word 1) Bit12 SIGN2 Bit11 VOF2[2] Bit10 VOF2[1] Bit9 VOF2[0] Bit8 SIGN1 Bit7 VOF1[2] Bit6 VOF1[1] Bit5 VOF1[0] Bit4~Bit0 - * Bit 12 (SIGN2): Polarity bit of offset voltage. 0: Negative voltage 1: Positive voltage * Bit 11 ~ Bit 9 (VOF2[2]~VOF2[0]): Offset voltage bits * Bit 8 (SIGN1): Polarity bit of offset voltage. 0: Negative voltage 1: Positive voltage * Bit 7 ~ Bit 5 (VOF1[2]~VOF210)): Offset voltage bits * Bit 4 ~ Bit 0 : Not used. 4.15 Instruction Set Each instruction in the instruction set is a 13-bit word divided into an OP code and one or more operands. Normally, all instructions are executed within one single instruction cycle (one instruction consists of 2 oscillator periods), unless the program counter is changed by instruction "MOV R2,A", "ADD R2,A", or by instructions of arithmetic or logic operation on R2 (e.g. "SUB R2,A", "BS(C) R2,6", "CLR R2", ). In this case, the execution takes two instruction cycles. In addition, the instruction set has the following features: (1) Every bit of any register can be set, cleared, or tested directly. (2) The I/O registers can be regarded as general registers. That is, the same instruction can operate on I/O registers. The symbol "R" represents a register designator that specifies which one of the registers (including operational registers and general-purpose registers) is to be utilized by the instruction. The symbol "b" represents a bit field designator that selects the value for the bit located in the register "R" that is This specification is subject to change without prior notice. 51 06.25.2004 (V1.4) EM78P458/459 OTP ROM affected by the operation. The symbol "k" represents an 8 or 10-bit constant or literal value. Table 16 The list of the instruction set of EM78P458/459 INSTRUCTION BINARY 0 0000 0000 0000 0 0000 0000 0001 0 0000 0000 0010 0 0000 0000 0011 0 0000 0000 0100 0 0000 0000 rrrr 0 0000 0001 0000 0 0000 0001 0001 0 0000 0001 0010 0 0000 0001 0011 0 0000 0001 0100 0 0000 0001 rrrr 0 0000 01rr rrrr 0 0000 1000 0000 0 0000 11rr rrrr 0 0001 00rr rrrr 0 0001 01rr rrrr 0 0001 10rr rrrr 0 0001 11rr rrrr 0 0010 00rr rrrr 0 0010 01rr rrrr 0 0010 10rr rrrr 0 0010 11rr rrrr 0 0011 00rr rrrr 0 0011 01rr rrrr 0 0011 10rr rrrr 0 0011 11rr rrrr 0 0100 00rr rrrr 0 0100 01rr rrrr 0 0100 10rr rrrr 0 0100 11rr rrrr 0 0101 00rr rrrr 0 0101 01rr rrrr 0 0101 10rr rrrr 0 0101 11rr rrrr 0 0110 00rr rrrr 0 0110 01rr rrrr 0 0110 10rr rrrr 0 0110 11rr rrrr 0 0111 00rr rrrr 0 0 0 0 0111 0111 0111 100b 01rr 10rr 11rr bbrr rrrr rrrr rrrr rrrr HEX MNEMONIC 0000 NOP 0001 DAA 0002 CONTW 0003 SLEP 0004 WDTC 000r IOW R 0010 ENI 0011 DISI 0012 RET 0013 RETI 0014 CONTR 001r IOR R 00rr MOV R,A 0080 CLRA 00rr CLR R 01rr SUB A,R 01rr SUB R,A 01rr DECA R 01rr DEC R 02rr OR A,R 02rr OR R,A 02rr AND A,R 02rr AND R,A 03rr XOR A,R 03rr XOR R,A 03rr ADD A,R 03rr ADD R,A 04rr MOV A,R 04rr MOV R,R 04rr COMA R 04rr COM R 05rr INCA R 05rr INC R 05rr DJZA R 05rr DJZ R 06rr 06rr 06rr 06rr 07rr 07rr 07rr 07rr 0xxx RRCA R RRC R RLCA R RLC R SWAPA R SWAP R JZA R JZ R BC R,b OPERATION No Operation Decimal Adjust A A CONT 0 WDT, Stop oscillator 0 WDT A IOCR Enable Interrupt Disable Interrupt [Top of Stack] PC [Top of Stack] PC, Enable Interrupt CONT A IOCR A AR 0A 0R R-A A R-A R R-1 A R-1 R A VR A A VR R A&RA A&RR ARA ARR A+RA A+RR RA RR /R A /R R R+1 A R+1 R R-1 A, skip if zero R-1 R, skip if zero R(n) A(n-1), R(0) C, C A(7) R(n) R(n-1), R(0) C, C R(7) R(n) A(n+1), R(7) C, C A(0) R(n) R(n+1), R(7) C, C R(0) R(0-3) A(4-7), R(4-7) A(0-3) R(0-3) R(4-7) R+1 A, skip if zero R+1 R, skip if zero 0 R(b) 52 STATUS AFFECTED None C None T,P T,P None This specification is subject to change without prior notice. 06.25.2004 (V1.4) EM78P458/459 OTP ROM INSTRUCTION BINARY 0 101b bbrr rrrr 0 110b bbrr rrrr 0 111b bbrr rrrr 1 00kk kkkk kkkk 1 1 1 1 1 01kk 1000 1001 1010 1011 kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk kkkk HEX 0xxx 0xxx 0xxx 1kkk 1kkk 18kk 19kk 1Akk 1Bkk 1Ckk 1Dkk 1E01 1Fkk 0020 MNEMONIC BS R,b JBC R,b JBS R,b CALL k JMP k MOV A,k OR A,k AND A,k XOR A,k RETL k SUB A,k INT ADD A,k TBL OPERATION 1 R(b) if R(b)=0, skip if R(b)=1, skip PC+1 [SP], (Page, k) PC (Page, k) PC kA AkA A&kA AkA k A, [Top of Stack] PC k-A A PC+1 [SP], 001H PC k+A A R2+A R2 Bits 8~9 of R2 unchanged STATUS AFFECTED None 1 1100 kkkk kkkk 1 1101 kkkk kkkk 1 1110 0000 0001 1 1111 kkkk kkkk 0 0000 0010 0000 This specification is subject to change without prior notice. 53 06.25.2004 (V1.4) EM78P458/459 OTP ROM 4.16 Timing Diagrams AC Test Input/Output W aveform 2.4 2.0 0.8 0.4 TEST POINTS 2.0 0.8 AC Testing : Input is driven at 2.4V for logic "1",and 0.4V for logic "0".Timing measurements are made at 2.0V for logic "1",and 0.8V for logic "0". RESET Timing (CLK="0") NOP Instruction 1 Executed CLK /RESET Tdrh TCC Input Timing (CLKS="0") Tins CLK TCC Ttcc This specification is subject to change without prior notice. 54 06.25.2004 (V1.4) EM78P458/459 OTP ROM 5. ABSOLUTE MAXIMUM RATINGS Items Temperature under bias Storage temperature Input voltage Output voltage 0C -65C -0.3V -0.3V Rating to to to to 70C 150C +6.0V +6.0V This specification is subject to change without prior notice. 55 06.25.2004 (V1.4) EM78P458/459 OTP ROM 6. ELECTRICAL CHARACTERISTICS 6.1 DC Electrical Characteristic(Ta=0C ~ 70 C, VDD=5.0V5%, VSS=0V) Symbol Fxt IIL VIH1 VIL1 VIHT1 VILT1 VIHX1 VILX1 VIH2 VIL2 VIHT2 VILT2 VIHX2 VILX2 VOH1 VOL1 VOL2 IPH IPD ISB ISB Parameter XTAL: VDD to 3V XTAL: VDD to 5V RC: VDD to 5V Input Leakage Current for input pins Input High Voltage,VDD=5V Input Low Voltage,VDD=5V Input High Threshold Voltage,VDD=5V Input Low Threshold Voltage,VDD=5V Clock Input High Voltage,VDD=5V Clock Input Low Voltage,VDD=5V Input High Voltage,VDD=3V Input Low Voltage,VDD=3V Input High Threshold Voltage,VDD=3V Input Low Threshold Voltage,VDD=3V Clock Input High Voltage,VDD=3V Clock Input Low Voltage,VDD=3V Output High Voltage (Ports 5, 6) Output Low Voltage (P51~P57, P60~P63, P66~P67) Output Low Voltage (P64,P65) Pull-high current Pull-down current Power down current Power down current Operating supply current (VDD=3V) at two clocks Operating supply current (VDD=3V) at two clocks Operating supply current (VDD=5.0V) at two clocks Operating supply current (VDD=5.0V) at two clocks Condition Two cycle with two clocks R: 5.1K, C: 100pF VIN = VDD, VSS Ports 5, 6 Ports 5, 6 /RESET, TCC /RESET, TCC OSCI OSCI Ports 5, 6 Ports 5, 6 /RESET, TCC /RESET, TCC OSCI OSCI IOH = -12.0 mA IOL = 12.0 mA IOL = 16.0 mA Pull-high active, input pin at VSS Pull-down active, input pin at VDD All input and I/O pins at VDD, output pin floating, WDT enabled All input and I/O pins at VDD, output pin floating, WDT disabled /RESET='High',Fosc=32KHz (Crystal type, two clocks), output pin floating, WDT disabled /RESET=`High',Fosc=32KHz (Crystal type, two clocks), output pin floating, WDT enabled /RESET='High', Fosc=2MHz (Crystal type, two clocks), output pin floating /RESET='High', Fosc=4MHz (Crystal type, two clocks), output pin floating Min DC DC F30% 2.0 0.8 2.0 0.8 2.5 1.0 1.5 0.4 1.5 0.4 1.5 0.6 2.4 0.4 0.4 -50 25 -100 50 -240 120 10 1 Typ Max 8 20 F30% 1 Unit MHz MHz KHz A V V V V V V V V V V V V V V V A A A A 760 ICC1 15 30 A ICC2 19 35 A ICC3 ICC4 2 4.0 mA mA This specification is subject to change without prior notice. 56 06.25.2004 (V1.4) EM78P458/459 OTP ROM 6.2 AC Electrical Characteristic(Ta=0C ~ 70 C, VDD=5V5%, VSS=0V) Symbol Dclk Tins Ttcc Tdrh Trst Twdt Tset Thold Tdelay Parameter Input CLK duty cycle Instruction cycle time (CLKS="0") TCC input period Device reset hold time /RESET pulse width Watchdog timer period Input pin setup time Input pin hold time Output pin delay time Conditions Crystal type RC type Ta = 25C Ta = 25C Ta = 25C Min 45 100 500 (Tins+20)/N* 9 2000 9 Typ 50 Max 55 DC DC 30 30 Unit % ns ns ns ms ns ms ms ms ms 18 18 0 20 50 Cload=20pF *N= selected prescaler ratio. 6.3 A/D Converter Characteristic(Vdd=3.0V to 5.5V,Vss=0V,Ta=0 to 70J ) Symbol VAREF VASS VAI IAI RN LN DNL FSE OE ZAI TAD TCN ADIV ADOV ADSR PSR Parameter Analog reference voltage Analog input voltage Analog supply current Resolution Linearity error Differential nonlinear error Full scale error Offset error Recommended impedance of analog voltage source A/D clock period A/D conversion time A/D OP input voltage range A/D OP output voltage swing A/D OP slew rate Power Supply Rejection Condition VAREF - VASSU 2.5V Min. 3.0 VASS 500 6 0 0 0 0 0 Vdd=VAREF=5.0V, VASS =0.0V Vdd=VAREF=5.0V, VASS =0.0V Vdd=VAREF=5.0V, VASS =0.0V Vdd=VAREF=5.0V, VASS =0.0V,RL=10K Vdd=VAREF=5.0V, VASS =0.0V Vdd=5.0V0.5V 3 10 0 0 4.7 0.1 0 Typ. Max. Vdd Vss VAREF 1000 8 4 0.9 4 2 10 4 10 5 0.3 5 2 Unit V V V uA Bits LSB LSB LSB LSB K us TAD V V V/us LSB Vdd=VAREF=5.0V, VASS =0.0V Vdd=VAREF=5.0V, VASS =0.0V Vdd = 2.5 to 5.5V Ta=25J Vdd = 2.5 to 5.5V Ta=25J Vdd=VAREF=5.0V, VASS =0.0V Vdd=VAREF=5.0V, VASS =0.0V 700 7 2 0.5 2 1 8 3.5 0.2 4.8 0.3 Note: 1.These parameters are characterized but not tested. 2.These parameters are for design guidance only and are not tested. 3.It will not consume any current other than minor leakage current, when A/D is off. 4.The A/D conversion result never decrease with an increase in the input voltage, and has no missing code. 5.Specifications subject to change without notice. This specification is subject to change without prior notice. 57 06.25.2004 (V1.4) EM78P458/459 OTP ROM 6.4 Comparator(OP) Characteristic(Vdd = 5.0V,Vss=0V,Ta=0 to 70J ) Symbol SR IVR OVS Iop PSRR Vos Vs Parameter Slew rate Input voltage range Output voltage swing Supply current of OP Power-supply Rejection Ration for OP Offset voltage Operating range Condition Vdd =5.0V, VSS =0.0V Vd =5.0V, VSS =0.0V,RL=10K Min. 0.1 0 0 4.7 250 50 2.5 Typ. 0.2 0.2 4.8 350 60 10 Max. 5 0.3 5 500 70 20 5.5 Unit V/us V V uA dB mV V Vdd= 5.0V, VSS =0.0V Vdd= 5.0V, VSS =0.0V Note: 1.These parameters are characterized but not tested. 2.These parameters are for design guidance only and are not tested. 3.Specifications subject to change without notice. 6.5 Device characteristic The graphic provided in the following pages were derived based on a limited number of samples and are shown here for reference only. The device characteristic illustrated herein are not guaranteed for it accuracy. In some graphic, the data maybe out of the specified warranted operating range. This specification is subject to change without prior notice. 58 06.25.2004 (V1.4) EM78P458/459 OTP ROM Vih/Vil (Inputpins with schm inverter) itt 2.5 Vih max(0J to 70J ) Vih typ 25J 2 Vih Vil(Volt ) Vih min(0J to 70J ) 1.5 1 Vil max(0J to 70J ) 0.5 Vil typ 25J Vil min(0J to 70J ) 0 2.5 3 3.5 4 Vdd(Volt) 4.5 5 5.5 Fig. 25 Vih, Vil of P50 Vs VDD Vih/Vil (Input pins with schmitt inverter) 2.5 Vih max(0J to 70J ) Vih typ 25J Vih min(0J to 70J ) 2 Vih Vil(Volt) 1.5 1 Vil max(0J to 70J ) 0.5 Vil typ 25J Vil min(0J to 70J ) 0 2.5 3 3.5 4 Vdd(Volt) 4.5 5 5.5 Fig. 26 Vih, Vil of P51,P52,P54 Vs VDD This specification is subject to change without prior notice. 59 06.25.2004 (V1.4) EM78P458/459 OTP ROM Vih/Vil (Inputpins with schm inverter) itt 2.5 Vih max(0J to 70J ) Vih typ 25J Vih Vil(Volt) 2 1.5 1 Vih min(0J to 70J ) Vil max(0J to 70J ) 0.5 0 2.5 3 3.5 4 4.5 Vil typ 25J Vil min(0J to 70J ) 5 5.5 Vdd( olt) V Fig. 27 Vih, Vil of P53,P55~P57,P60~P67 Vs VDD Voh/Ioh (VDD=5 V) Voh/I oh (VDD=3V ) 0 0 -5 -2 -10 -4 Ioh(mA) -15 Min 70 J Typ 25 J Max 0 J Ioh(mA ) Min 70 J -6 Typ 25 J -8 -20 Max 0 J -10 -25 -30 0 1 2 3 4 5 -12 0 0.5 1 1.5 2 2.5 3 Voh(Vol t) Voh( olt) V This specification is subject to change without prior notice. 60 06.25.2004 (V1.4) EM78P458/459 OTP ROM Fig.28 Port5, Port6, Voh vs. Ioh, VDD=5V Fig.29 Port5, Port6, Voh vs. Ioh, VDD=3V Vol/Iol (VDD=5 V) Vol/Iol (VDD=3V) 35 80 70 60 50 Max 0 J Typ 25 J Min 70 J Iol(mA ) Max 0 J Typ 25 J Min 70 J 30 25 Iol(mA) 20 40 30 20 10 0 0 1 2 3 4 5 15 10 5 0 0 0.5 1 1.5 2 2.5 3 Vol(Volt) Vol(Volt) Fig. 30 Port5, and P60~P63,P66,P67 Vol, VDD=5V Fig. 31 Port5, and P60~P63,P66,P67 Vol , VDD=3V This specification is subject to change without prior notice. 61 06.25.2004 (V1.4) EM78P458/459 OTP ROM Vol/Iol (3V) 50 45 40 35 50 Vol/Iol (3 V) Max 0 J Typ 25 J Iol(mA) 45 40 35 30 25 20 15 10 5 0 Max 0 J Typ 25 J Min 70 J Iol(mA) 30 25 20 15 10 5 0 0 0.5 1 1.5 Min 70 J 2 2 .5 3 0 0.5 1 1.5 2 2.5 3 Vol(Volt) Vol(Vo lt) Fig. 32 P64,P65 Vol vs. Iol, VDD=5V Fig. 33 P64,P65 Vol vs. Iol, VDD=3V This specification is subject to change without prior notice. 62 06.25.2004 (V1.4) EM78P458/459 OTP ROM WDT Time_ o u t 35 30 Max 70 J WDT period (mS) 25 Typ 25 J 20 Min 0 J 15 10 5 0 2 3 4 VDD (Volt) 5 6 Fig. 34 WDT Time Out Period vs. VDD, Prescaler Set to 1 : 1 This specification is subject to change without prior notice. 63 06.25.2004 (V1.4) EM78P458/459 OTP ROM Cex t=1 0 0 p F Ty p i c RC OSC Freq u e cy , al n 1.4 R = 3.3 k 1.2 1 R = 5.1 k Frequency(M Hz) 0.8 0.6 R = 10 k 0.4 0.2 R = 100 k 0 2.5 3 3.5 4 4.5 VDD(Volt) 5 5.5 Fig. 35 Typical RC OSC Frequency vs. VDD ] Cext=100pF, Temperature at 25 J^ This specification is subject to change without prior notice. 64 06.25.2004 (V1.4) EM78P458/459 OTP ROM Four conditions exist with the operating current ICC1 to ICC4. these conditions are as followsG ICC1G VDD=3V, Fosc=32 kHz, 2clock, WDT disable. ICC2G VDD=3V, Fosc=32 kHz, 2clock, WDT enable. ICC3G VDD=5V, Fosc=2 MHz, 2clock, WDT enable. ICC4G VDD=5V, Fosc=4 MHz, 2clock, WDT enable. Typical ICC1 and ICC2 vs. Temperature 21 Typ ICC2 Typ ICC1 Current (uA) 18 15 12 9 0 10 20 30 40 50 60 70 Temperature (J ) vs. Temperature Fig. 36 Typical Operating Current] ICC1 and ICC2^ Maximum ICC1 and ICC2 vs. Temperature 30 27 Max ICC2 Current (uA) 24 21 18 15 0 10 20 30 40 50 Max ICC1 60 70 Temperature (J ) Fig. 37 Maximum Operating Current] ICC1 and ICC2^ vs. Temperature This specification is subject to change without prior notice. 65 06.25.2004 (V1.4) EM78P458/459 OTP ROM Typical ICC3 and ICC4 vs. Temperature 1.9 Current (mA) 1.7 1.5 1.3 1.1 0.9 0.7 0.5 0 10 20 30 40 50 Typ ICC4 Typ ICC3 60 70 Temperature (J ) Fig. 38 Typical Operating Current] ICC3 and ICC4^ vs. Temperature Maximum ICC3 and ICC4 vs. Temperature 2.2 2 Max ICC4 Current (mA) 1.8 1.6 1.4 1.2 1 0 10 20 30 40 50 60 70 Max ICC3 Temperature (J ) vs. Temperature Fig. 39 Maximum Operating Current] ICC3 and ICC4^ Two conditions exist with the standby current ISB1 and ISB2. these conditions are as followG ISB1G VDD=5V, WDT disable ISB2G VDD=5V, WDT enable This specification is subject to change without prior notice. 66 06.25.2004 (V1.4) EM78P458/459 OTP ROM Typical ISB1 and ISB2 vs. Temperature 12 9 Current (uA) 6 3 Typ ISB2 Typ ISB1 0 0 10 20 30 40 50 60 70 Temperature (J ) Fig. 40 Typical Standby Current] ISB1 and ISB2^ vs. Temperature Maximum ISB1 and ISB2 vs. Temperature 12 9 Max ISB2 Current (uA) 6 3 Max ISB1 0 0 10 20 30 40 50 60 70 Temperature (J ) Fig. 41 Maximum Standby Current] ISB1 and ISB2^ vs. Temperature This specification is subject to change without prior notice. 67 06.25.2004 (V1.4) EM78P458/459 OTP ROM Operating voltage (0J~70J) 25 Frequency(M Hz) 20 15 10 5 0 2 2.5 3 3 .5 4 4.5 5 5 .5 6 VDD(Vol) t Fig. 42 Operating Voltage In Temperature Range from 0 J to 70 J This specification is subject to change without prior notice. 68 06.25.2004 (V1.4) EM78P458/459 OTP ROM EM78P458/459 HXT I-V 2.5 2 1.5 1 0.5 0 2 2.5 3 3.5 4 4.5 5 5.5 6 Fig. 43 EM78P458/459 I-V Curve Operating at 4 MHz EM78P 4 59 H I-V 458/ XT 2.5 2 1.5 1 0.5 0 2 3 4 5 6 Fig. 44 EM78P458_G/459-G I-V Curve Operating at 4 MHz This specification is subject to change without prior notice. 69 06.25.2004 (V1.4) EM78P458/459 OTP ROM EM78P 4 59 L I-V 458/ XT 200 150 100 50 0 2 3 4 5 6 Fig. 45 EM78P458/459 I-V Curve Operating at 32.768 kHz EM78P 4 59 L I-V 458/ XT 140 120 100 80 60 40 20 0 2 3 4 5 6 Fig. 46 EM78P458_G/459_G I-V Curve Operating at 32.768 kHz This specification is subject to change without prior notice. 70 06.25.2004 (V1.4) EM78P458/459 OTP ROM APPENDIX Package Types: OTP MCU EM78P458AP EM78P458AM EM78P459AK EM78P459AM Package Type DIP SOP Skinny DIP SOP Pin Count 20 pin 20 pin 24 pin 24 pin Package Size 300mil 300mil 300mil 300mil This specification is subject to change without prior notice. 71 06.25.2004 (V1.4) EM78P458/459 OTP ROM Package Information 20-Lead Plastic Dual in line (PDIP) X 300 mil This specification is subject to change without prior notice. 72 06.25.2004 (V1.4) EM78P458/459 OTP ROM 20-Lead Plastic Small Outline (SOP) X 300 mil This specification is subject to change without prior notice. 73 06.25.2004 (V1.4) EM78P458/459 OTP ROM 24-Lead Plastic Dual in line (PDIP) X 300 mil This specification is subject to change without prior notice. 74 06.25.2004 (V1.4) EM78P458/459 OTP ROM 24-Lead Plastic Small Outline (SOP) X 300 mil This specification is subject to change without prior notice. 75 06.25.2004 (V1.4) EM78P458/459 OTP ROM ELAN (HEADQUARTER) MICROELECTRONICS CORP., LTD. Address : No. 12, Innovation 1st. Rd. Science-Based Industrial Park, Hsinchu City, Taiwan. Telephone: 886-3-5639977 Facsimile : 886-3-5639966 ELAN (H.K.) MICROELECTRONICS CORP., LTD. Address : Rm. 1005B, 10/F, Empire Centre, 68 Mody Road, Tsimshatsui, Kowloon, Hong Kong. Telephone: 852-27233376 Facsimile : 852-27237780 E-mail : elanhk@emc.com.hk ELAN MICROELECTRONICS SHENZHEN, LTD. Address : SSMEC Bldg. 3F , Gaoxin S. Ave. 1st , South Area , Shenzhen High-tech Industrial Park., Shenzhen Telephone: 86-755-26010565 Facsimile : 86-755-26010500 ELAN MICROELECTRONICS SHANGHAI, LTD. Address : #23 Building No.115 Lane 572 BiBo Road. Zhangjiang, Hi-tech Park, Shanghai Telephone: 86-21-50803866 Facsimile : 86-21-50804600 Elan Information Technology Group. Address: 1821 Saratoga Avenue, suite 250, Saratoga, CA 95070, USA Telephone: 1-408-366-8225 Facsimile : 1-408-366-8220 Elan Microelectronics Corp. (Europe) Address: Dubendorfstrasse 4, 8051 Zurich, Switzerland Telephone: 41-43-2994060 Facsimile : 41-43-2994079 Email : info@elan-europe.com Web-Site : www.elan-europe.com Copyright (c) 2004 ELAN Microelectronics Corp. All rights reserved. ELAN owns the intellectual property rights, concepts, ideas, inventions, know-how (whether patentable or not) related to the Information and Technology (herein after referred as " Information and Technology") mentioned above, and all its related industrial property rights throughout the world, as now may exist or to be created in the future. ELAN represents no warranty for the use of the specifications described, either expressed or implied, including, but not limited, to the implied warranties of merchantability and fitness for particular purposes. The entire risk as to the quality and performance of the application is with the user. In no even shall ELAN be liable for any loss or damage to revenues, profits or goodwill or other special, incidental, indirect and consequential damages of any kind, resulting from the performance or failure to perform, including without limitation any interruption of business, whatever resulting from breach of contract or breach of warranty, even if ELAN has been advised of the possibility of such damages. The specifications of the Product and its applied technology will be updated or changed time by time. All the information and explanations of the Products in this website is only for your reference. The actual specifications and applied technology will be based on each confirmed order. ELAN reserves the right to modify the information without prior notification. The most up-to-day information is available on the website http://www.emc.com.tw. This specification is subject to change without prior notice. 76 06.25.2004 (V1.4) |
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